SNVSCC9 November   2023 LP5812

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. 7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Time-cross-multiplexing (TCM) scheme
        1. 8.3.1.1 Direct drive mode
        2. 8.3.1.2 TCM drive mode
        3. 8.3.1.3 Mix drive mode
        4. 8.3.1.4 Ghosting elimination
      2. 8.3.2 Analog Dimming
      3. 8.3.3 PWM Dimming
      4. 8.3.4 Autonomous Animation Engine Control
        1. 8.3.4.1 Animation Engine Pattern
        2. 8.3.4.2 Sloper
        3. 8.3.4.3 Animation Engine Unit (AEU)
        4. 8.3.4.4 Animation Pause Unit (APU)
      5. 8.3.5 Protections and Diagnostics
        1. 8.3.5.1 LED Open Detections
        2. 8.3.5.2 LED Short Detections
        3. 8.3.5.3 Thermal Shutdown
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
    6. 8.6 Register Maps
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Parameters
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Input Capacitor Selection
        2. 9.2.3.2 Program Procedure
        3. 9.2.3.3 Programming Example
      4. 9.2.4 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
  • DSD|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20220920-SS0I-Q3FW-GRN1-Q460XLGVPWXR-low.svg Figure 5-1 LP5812 YBH Package 9-Pin DSBGA Top View
GUID-20220920-SS0I-D3XL-TFXQ-WQVPFCCRZH9G-low.svg Figure 5-2 LP5812 DSD Package 8-Pin WSON Top View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME YBH DSD
OUT0 A1 8 O Output 0 which contains current sink and scan FET. If not used, this pin must be floating.
GND A2 Thermal pad G Ground. This pin must connect to the common ground plane.
VCC A3 1 P Power supply of the device.
OUT1 B1 7 O Output 1 which contains current sink and scan FET. If not used, this pin must be floating.
SYNC B2 2 I/O Clock synchronous among multiple devices. If not used, this pin can connect to ground to save power.
SCL B3 3 I I2C serial interface clock input.
OUT2 C1 6 O Output 2 which contains current sink and scan FET. If not used, this pin must be floating.
OUT3 C2 5 O Output 3 which contains current sink and scan FET. If not used, this pin must be floating.
SDA C3 4 I/O I2C serial interface data input/output.
(1) G: Ground Pin; P: Power Pin; I: Input Pin; I/O: Input/Output Pin; O: Output Pin.