SNVS345G June   2006  – December 2014 LP5951

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Enable Control Characteristics
    7. 6.7 Transient Characteristics
    8. 6.8 Output Capacitor, Recommended Specification
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 No-Load Stability
      2. 7.3.2 Enable Operation
      3. 7.3.3 Fast Turn Off And On
      4. 7.3.4 Short-Circuit Protection
      5. 7.3.5 Thermal-Overload Protection
      6. 7.3.6 Reverse Current Path
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation And Device Operation
        2. 8.2.2.2 External Capacitors
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 Capacitor Characteristics
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Output Current Derating
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)(1)
MIN MAX UNIT
IN pin: Voltage to GND –0.3 6.5 V
EN pin: Voltage to GND –0.3 to (VIN + 0.3 V)(2) 6.5
Continuous power dissipation(3) Internally limited
Junction temperature (TJ-MAX ) 150 °C
Package peak reflow temperature (10-20 s) 240
Package peak reflow temperature (Pb-free, 10-20 s) 260
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The lower of VIN + 0.3 or 6.5 V.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and disengages at TJ = 140°C (typ.).

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN NOM MAX UNIT
VIN Input voltage 1.8 5.5 V
VEN Enable input voltage 0 (VIN + 0.3) V
TJ Junction temperature –40 125 °C
TA Ambient temperature See Power Dissipation And Device Operation
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.

6.4 Thermal Information

THERMAL METRIC(1) LP5951 UNIT
SOT-23 (DBV) SC70 (DCK)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 195.6  276.7  °C/W
RθJC(top) Junction-to-case (top) thermal resistance 108.3  86.3 
RθJB Junction-to-board thermal resistance 52.1  56.9 
ψJT Junction-to-top characterization parameter 11.0 1.3
ψJB Junction-to-board characterization parameter 51.6 56.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

All typical (TYP) values and limits are for TA = TJ = 25°C, and minimum (MIN) and maximum (MAX) limits apply over the operating junction temperature range (TJ ) of –40°C to 125°C unless otherwise specified in the Test Conditions. Unless otherwise noted, VIN = VOUT(NOM) + 1 V, CIN = 1 µF, COUT = 1 µF, VEN = 0.9 V. (1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage VIN ≥ VOUT(NOM) + VDO 1.8 5.5 V
ΔVOUT Output voltage tolerance IOUT = 1mA
TJ = 25°C		 –2% 2%
IOUT = 1mA
–30°C ≤ TJ ≤ +125°C		 –3.5% 3.5%
Line regulation error VIN = VOUT(NOM) + 1 V to 5.5 V

IOUT = 1 mA

 0.1 %/V
Load regulation error IOUT = 1 mA to 150 mA –0.01 %/mA
VDO Output voltage dropout(3) IOUT = 150 mA , VOUT ≥ 2.5 V 250 mV
IOUT = 150 mA , VOUT < 2.5 V 200 350
IQ Quiescent current VEN = 0.9 V, ILOAD = 0 29 55 µA
VEN = 0.9 V, ILOAD = 150 mA 33 70
VEN = 0 V, TJ = 25°C 0.005 1
ISC Output current (short circuit) VIN = VOUT(NOM) + 1 V 150 400 mA
PSRR Power supply rejection ratio Sine modulated VIN, ƒ = 100 Hz 60 dB
Sine modulated VIN, ƒ = 1 kHz 60
Sine modulated VIN, ƒ = 10 kHz 50
EN Output noise BW = 10 Hz - 100 kHz 125 µVRMS
TSD Thermal shutdown 160 °C
Temperature hysteresis 20
(1) All voltages are with respect to the potential at the GND pin.
(2) Minimum and Maximum limits are ensured through test, design, or statistical correlation over the operating junction temperature range (TJ ) of –40°C to 125°C, unless otherwise stated. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
(3) Dropout voltage is defined as the input to output voltage differential at which the output voltage falls to 100 mV below the nominal output voltage. This specification does not apply for output voltages below 1.8 V.

6.6 Enable Control Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IEN Maximum input current at EN input 0 V ≤ VEN ≤ VIN, VIN = 5.5 V
–40°C ≤ TJ ≤ 125°C		 –1 1 µA
VIL Low input threshold (shutdown) VIN = 1.8 V to 5.5 V
–40°C ≤ TJ ≤ 125°C		 0.4 V
VIH High input threshold (enable) VIN = 1.8 V to 5.5 V
–40°C ≤ TJ ≤ 125°C		 0.9

6.7 Transient Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ΔVOUT Dynamic line transient VIN = VOUT(NOM) + 1 V to
VOUT(NOM) + 1 V + 0.6 V in 30 µs, no load		 ±2 mV
ΔVOUT Dynamic load transient IOUT = 0 mA to 150 mA in 10 µs
IOUT = 150 mA to 0 mA in 10 µs
IOUT = 1 mA to 150 mA in 1 µs
IOUT = 150 mA to 1 mA in 1 µs		 -30
20
-50
40		 mV
mV
mV
mV
ΔVOUT Overshoot on start-up Nominal conditions 10 mV
TON Turnon time IOUT = 1 mA 30 µs

6.8 Output Capacitor, Recommended Specification

PARAMETER TEST CONDITIONS MIN(1) TYP MAX(1) UNIT
COUT Output capacitance Capacitance(2)
IOUT = 150 mA, VIN = 5 V		 0.7 1 47 µF
ESR 0.003 0.300 Ω
(1) Min and Max limits are ensured by design.
(2) The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is X7R. However, dependent on application, X5R, Y5V, and Z5U can also be used. The shown minimum limit represents real minimum capacitance, including all tolerances and must be maintained over temperature and dc bias voltage (see External Capacitors in Application and Implementation section).

6.9 Typical Characteristics

Unless otherwise specified, CIN = 1 µF ceramic, COUT = 1 µF ceramic, VIN = VOUT(NOM) + 1 V, TA = 25°C; EN pin is tied to VIN.
20136209.gif
Figure 1. Load Transient Response
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Figure 3. Line Transient Response
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Figure 2. Load Transient Response
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Figure 4. Line Transient Response
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Figure 5. Enable Start-Up Time
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Figure 7. Output Voltage Change vs Temperature
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Figure 9. Power Supply Rejection Ratio
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Figure 6. Enable Start-Up Time
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Figure 8. Ground Current vs VIN