SNVSCH5 November   2023 LP87745

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Description (continued)
  6. 5Pin Configuration and Functions
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Packaging Option Addendum
    2. 8.2 Tape and Reel Information
    3.     18

Package Options

Mechanical Data (Package|Pins)
  • RXV|28
Thermal pad, mechanical data (Package|Pins)

6.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.