SLVSCP5H July   2014  – April 2021 LSF0204 , LSF0204D

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.8 V)
    7. 7.7  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.2 V)
    8. 7.8  Switching Characteristics: AC Performance (Translating Up, 1.8 V to 3.3 V)
    9. 7.9  Switching Characteristics: AC Performance (Translating Up, 1.2 V to 1.8 V)
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Load Circuit AC Waveform for Outputs
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Support High Speed Translation, Greater than 100 MHz
      2. 9.3.2 Bidirectional Voltage Translation Without DIR Terminal
      3. 9.3.3 5-V Tolerance on IO Port and 125°C Support
      4. 9.3.4 Channel Specific Translation
      5. 9.3.5 Ioff, Partial Power Down Mode
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 I2C PMBus, SMBus, GPIO, Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Bidirectional Translation
            1. 10.2.1.2.1.1 Pull-Up Resistor Sizing
          2. 10.2.1.2.2 LS Family Bandwidth
        3. 10.2.1.3 Application Curve
      2. 10.2.2 MDIO Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Multiple Voltage Translation in Single Device, Application
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGY|14
  • YZP|12
  • RUT|12
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information
10.2.1.2.1 Bidirectional Translation

The controller output driver may be push-pull or open-drain (pull-up resistors may be required) and the peripheral device output can be push-pull or open-drain (pull-up resistors are required to pull the Bn outputs to Vpu).

Note:

However, if either output is push-pull, data must be unidirectional or the outputs must be 3-state and be controlled by some direction-control mechanism to prevent HIGH-to-LOW contentions in either direction. If both outputs are open-drain, no direction control is needed.

In Figure 10-1, the reference supply voltage (Vref_A) is connected to the processor core power supply voltage. When Vref_B is connected through to a 3.3 V Vpu power supply, and Vref_A is set 1.0V. The output of A3 and B4 has a maximum output voltage equal to Vref_A, and the bidirectional interface (Ch1/2, MDIO) has a maximum output voltage equal to Vpu.