SLLS576G July   2003  – February 2024 MAX202

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power
      2. 6.3.2 RS-232 Driver
      3. 6.3.3 RS-232 Receiver
    4. 6.4 Device Functional Modes
      1. 6.4.1 VCC Powered by 5V
      2. 6.4.2 VCC Unpowered
      3. 6.4.3 Truth Tables
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Capacitor Selection
        2. 7.2.2.2 ESD Protection
        3. 7.2.2.3 ESD Test Conditions
        4. 7.2.2.4 Human-Body Model (HBM)
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) D (SOIC) DW (SOIC) PW (TSSOP) UNIT
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 84.6 71.7 107.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.5 37.6 38.4 °C/W
RθJB Junction-to-board thermal resistance 43.2 36.8 53.7 °C/W
ψJT Junction-to-top characterization parameter 10.4 13. 3.2 °C/W
ψJB Junction-to-board characterization parameter 42.8 36.4 53.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.