SLLS348P June   1999  – July 2021 MAX3221

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics – Power
    6. 6.6  Electrical Characteristics – Driver
    7. 6.7  Electrical Characteristics – Receiver
    8. 6.8  Electrical Characteristics – Status
    9. 6.9  Switching Characteristics – Driver
    10. 6.10 Switching Characteristics – Receiver
    11. 6.11 Switching Characteristics – Status
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1.     20
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
      4. 8.3.4 RS232 Status
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Support Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)MAX3221UNIT
DB (SSOP)PW (TSSOP)
16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance

105.8

110.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance

51.9

41.7°C/W
RθJBJunction-to-board thermal resistance

57.6

57.2°C/W
ψJTJunction-to-top characterization parameter14.14.2°C/W
ψJBJunction-to-board characterization parameter56.856.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.