SLLS708C January   2006  – January 2023 MAX3222E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2.     ESD Ratings
    3.     ESD Ratings - IEC Specifications
    4. 6.2 Recommended Operating Conditions
    5. 6.3 Thermal Information
    6. 6.4 Electrical Characteristics
    7. 6.5 Electrical Characteristics: Driver
    8. 6.6 Switching Characteristics: Driver
    9. 6.7 Electrical Characteristics: Receiver
    10. 6.8 Switching Characteristics: Receiver
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

ESD Ratings

TYP UNIT
V(ESD) Electrostatic Discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) All pins except RIN1, RIN2, DOUT1 and DOUT2 pins ±3000 V

RIN1, RIN2, DOUT1 and DOUT2 pins to GND

 ±15,000
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002 (2)

All pins

 ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.