SLLS350P April   1999  – October 2022 MAX3243

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics –– Auto Power Down
    6. 6.6  Electrical Characteristics –– Driver
    7. 6.7  Electrical Characteristics –– Receiver
    8. 6.8  Switching Characteristics –– Auto Power Down
    9. 6.9  Switching Characteristics –– Driver
    10. 6.10 Switching Characteristics –– Receiver
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 19
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Auto-Power-Down
      2. 8.3.2 Charge Pump
      3. 8.3.3 RS232 Driver
      4. 8.3.4 RS232 Receiver
      5. 8.3.5 ROUT2B Receiver
      6. 8.3.6 Invalid Input Detection
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics –– Auto Power Down

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 9-1)
PARAMETERTEST CONDITIONSMINTYP(1)MAXUNIT
ICCSupply current
Auto-powerdown
disabled
No load, FORCEOFF and FORCEON at VCC. TA = 25°C
For DB and PW package
0.31.2mA
Supply current
Auto-powerdown
disabled
No load, FORCEOFF and FORCEON at VCC. TA = 25°C
For DW package
0.3 1 mA
Supply current
Powered off
No load, FORCEOFF at GND. TA = 25°C110μA
Supply current
Auto-powerdown
enabled
No load, FORCEOFF at VCC, FORCEON at GND,
All RIN are open or grounded, All DIN are grounded. TA = 25°C
110
IIInput leakage current
of FORCEOFF, FORCEON
VI = VCC or VI at GND±0.01±1μA
VIT+Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
2.7V
VIT–Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7V
VTReceiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–0.30.3V
VOHINVALID high-level output voltageIOH = -1 mA, FORCEON = GND,
FORCEOFF = VCC
VCC – 0.6V
VOLINVALID low-level output voltageIOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
0.4V
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.