SLLS098D May   1980  – March 2024 MC3487

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
  7. Parameter Measurement Information
  8. Device Functional Modes
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NS|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1)D (SOIC)N (PDIP)NS (SOP)UNIT
16-PINS
R θJAJunction-to-ambient thermal resistance 84.660.688.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.548.146.2°C/W
R θJBJunction-to-board thermal resistance 43.240.650.7°C/W
ψ JTJunction-to-top characterization parameter 10.427.513.5°C/W
ψ JBJunction-to-board characterization parameter 42.840.350.3°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance N/AN/AN/A°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.