SBOS566C June   2017  – October 2018 OPA1692

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Preamplifier for 3-Wire Electret Microphones
      2.      THD + N vs Frequency (3 VRMS, 2-kΩ Load)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: OPA1692
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA1692
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Distortion Reduction
      2. 7.3.2 Phase Reversal Protection
      3. 7.3.3 Electrical Overstress
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Voltage
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
      2. 8.1.2 Noise Performance
      3. 8.1.3 Basic Noise Calculations
      4. 8.1.4 EMI Rejection
      5. 8.1.5 EMIRR +IN Test Configuration
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Other Application Examples
      1. 8.3.1 Two-Wire Electret Microphone Preamplifier
      2. 8.3.2 Battery-Powered Preamplifier for Professional Microphones
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 DIP Adapter EVM
        3. 11.1.1.3 Universal Operational Amplifier EVM
        4. 11.1.1.4 Smart Amplifier Speaker Characterization Board Evaluation Module
        5. 11.1.1.5 TI Precision Designs
        6. 11.1.1.6 WEBENCH Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resource
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Power Dissipation

The OPA169x series op amps are capable of driving 2-kΩ loads with a power-supply voltage up to ±18 V and full operating temperature range. Internal power dissipation increases when operating at high supply voltages. Copper leadframe construction used in the OPA169x series op amps improves heat dissipation compared to conventional materials. Circuit board layouts minimize junction temperature rise. Wide copper traces help dissipate the heat by acting as an additional heat sink. Temperature rise is further minimized by soldering the devices to the circuit board rather than using a socket.