SBOSAF2B June   2023  – March 2024 OPA2994 , OPA994

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Unlimited Capacitive Load Drive
      2. 6.3.2 Common-Mode Voltage Range
      3. 6.3.3 Phase Reversal Protection
      4. 6.3.4 Electrical Overstress
      5. 6.3.5 Overload Recovery
      6. 6.3.6 Typical Specifications and Distributions
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information for Dual Channel

THERMAL METRIC(1) OPA2994 Unit
D
(SOIC)		 DGK
(VSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 124.0 169.6        °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.3 61.6        °C/W
RθJB Junction-to-board thermal resistance 68.4 91.2        °C/W
ψJT Junction-to-top characterization parameter 19.9 9.0        °C/W
ψJB Junction-to-board characterization parameter 67.6 89.7        °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance TBD TBD        °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.