SBOS522A June   2010  – November 2019 OPA333-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      0.1-Hz to 10-Hz Noise
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rail-to-Rail Input Voltage
      2. 7.3.2 Internal Offset Correction
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Achieving Output Swing to the Op Amp Negative Rail
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Voltage-to-Current (V-I) Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Precision, Low-Level Voltage-to-Current (V-I) Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Composite Amplifier
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
      4. 8.2.4 Temperature Measurement
      5. 8.2.5 Single Op-Amp Bridge-Amplifier
      6. 8.2.6 Low-Side Current-Monitor
      7. 8.2.7 High-Side Current Monitor
      8. 8.2.8 Thermistor Measurement
      9. 8.2.9 Precision Instrumentation Amplifier
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (June 2010) to A Revision

  • Changed part number references from OPA333 to OPA333-Q1 throughout textGo
  • Added Pin Configuration and Functions, ESD Ratings, Thermal Information, Feature Description , Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout , Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted redundant Ordering Information table; same information already in the package option addendumGo
  • Changed pinout drawing for accuracy; no change to pin names or pin numbers Go
  • Deleted "one amplifier per package" from note 2 in Absolute Maximum Ratings tableGo
  • Changed the TYP and MAX values for the input offset voltage drift parameter in the Electrical Characteristics tableGo
  • Added text to Figure 3, Open-Loop Gain vs Frequency, for clarityGo
  • Deleted Single-Supply, Very-Low-Power ECG Circuit (previously, Figure 9)Go