SLOS868C December   2013  – May 2018 OPA355-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
    1. 5.1 Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Enable Function
      3. 8.3.3 Output Drive
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Transimpedance Amplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Optimizing The Transimpedance Circuit
        3. 9.2.1.3 Application Curve
      2. 9.2.2 High-Impedance Sensor Interface
      3. 9.2.3 Driving ADCs
      4. 9.2.4 Active Filter
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from B Revision (June 2014) to C Revision

  • Deleted "C55" marking on pinout drawing in Pin Configuration and Functions section Go
  • Added Pin Functions table to Pin Configuration and Functions section Go
  • Deleted storage temperature range from ESD Ratings table and moved to Absolute Maximum Ratings table Go
  • Changed title of Handling Ratings table to ESD Ratings table Go
  • Added Recommended Operating Conditions table Go
  • Added Functional Block Diagram Go
  • Deleted "Independent enable pins are available for each channel, which provide maximum design flexibility" from Enable Function sectionGo
  • Deleted Input and ESD Protection subsection in Feature Description sectionGo
  • Added Device Functional Modes sectionGo
  • Added Typical Applications section to Application and Implementation section Go
  • Added Design Requirements subsection to Typical Applications section Go
  • Added Detailed Design Procedure subsection to Typical Application section Go
  • Added application curves to the Typical Application section Go
  • Added High-Impedance Sensor Interface, Driving ADCs, and Active Filter subsections to Typical Application sectionGo
  • Added Power Supply Recommendations section Go
  • Added layout example image to Layout sectionGo

Changes from A Revision (December 2013) to B Revision

  • Changed device status from Product Preview to Production DataGo