SBOS637D October   2016  – June 2019 OPA2325 , OPA325 , OPA4325

PRODUCTION DATA.  

  1. Features
  2. Applications
    1.     Offset Voltage vs Input Common-Mode Voltage
  3. Description
    1.     The OPAx325 as an ADC Driver Amplifier
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions: OPA325
    2.     Pin Functions: OPA2325
    3.     Pin Functions: OPA4325
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA325
    5. 6.5 Thermal Information: OPA2325
    6. 6.6 Thermal Information: OPA4325
    7. 6.7 Electrical Characteristics: VS = 2.2 V to 5.5 V or ±1.1 V to ±2.75 V
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Zero-Crossover Input Stage
      2. 7.3.2 Low Input Offset Voltage
      3. 7.3.3 Input and ESD Protection
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Operating Characteristics
      2. 8.1.2 Basic Amplifier Configurations
      3. 8.1.3 Driving an Analog-to-Digital Converter
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Low Input Offset Voltage

The OPAx325 are manufactured using TI's e-trim technology. Each amplifier is trimmed in production, thereby minimizing errors associated with input offset voltage. The e-trim technology is a TI proprietary method of trimming internal device parameters during either wafer probing or final testing. This process allows the OPAx325 to have an excellent offset specification of 150 µV (maximum). Figure 42 shows the offset voltage distribution for the OPAx325.

OPA325 OPA2325 OPA4325 C002_SBOS637.pngFigure 42. Offset Voltage Distribution