SBOS303D June   2004  – December 2016 OPA820

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±5 V
    6. 7.6 Electrical Characteristics: VS = 5 V
    7. 7.7 Typical Characteristics
      1. 7.7.1 ±5-V Supply Voltage
      2. 7.7.2 5-V Supply Voltage
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Feature Description
      1. 9.2.1 Input and ESD Protection
      2. 9.2.2 Bandwidth versus Gain
      3. 9.2.3 Output Drive Capability
      4. 9.2.4 Driving Capacitive Loads
      5. 9.2.5 Distortion Performance
      6. 9.2.6 Noise Performance
      7. 9.2.7 DC Offset Control
      8. 9.2.8 Thermal Analysis
    3. 9.3 Device Functional Modes
      1. 9.3.1 Wideband Noninverting Operation
      2. 9.3.2 Wideband Inverting Operation
      3. 9.3.3 Wideband Single-Supply Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Optimizing Resistor Values
    2. 10.2 Typical Applications
      1. 10.2.1 Active Filter Design
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 High-Q Bandpass Filter Design Procedure
          2. 10.2.1.2.2 Low-Pass Butterworth Filter Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Buffering High-Performance ADCs
      3. 10.2.3 Video Line Driving
      4. 10.2.4 Single Differential Op Amp
      5. 10.2.5 Triple Differencing Op Amp (Instrumentation Topology)
      6. 10.2.6 DAC Transimpedance Amplifier
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Minimizing Parasitic Capacitance
      2. 12.1.2 Minimizing Distance from Power Supply to Decoupling Capacitors
      3. 12.1.3 Selecting and Placing External Components
      4. 12.1.4 Connecting Other Wideband Devices
      5. 12.1.5 Socketing
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Design-In Tools
        1. 13.1.1.1 Demonstration Fixtures
        2. 13.1.1.2 Macromodels and Applications Support
      2. 13.1.2 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.