SBOSA84 December   2022 OPT4048

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spectral Matching to CIE
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Output Register CRC and Counter
        1. 8.3.3.1 Output Sample Counter
        2. 8.3.3.2 Output CRC
        3. 8.3.3.3 Threshold Detection
      4. 8.3.4 Device Functional Modes
        1. 8.3.4.1 Modes of Operation
        2. 8.3.4.2 Interrupt Modes of Operation
        3. 8.3.4.3 Light Range Selection
        4. 8.3.4.4 Selecting Conversion Time
        5. 8.3.4.5 Light and Color Measurement
        6. 8.3.4.6 Light Resolution
        7. 8.3.4.7 Programming
          1. 8.3.4.7.1 I2C Bus Overview
            1. 8.3.4.7.1.1 Serial Bus Address
            2. 8.3.4.7.1.2 Serial Interface
          2. 8.3.4.7.2 Writing and Reading
            1. 8.3.4.7.2.1 High-Speed I2C Mode
            2. 8.3.4.7.2.2 Burst Read Mode
            3. 8.3.4.7.2.3 General-Call Reset Command
            4. 8.3.4.7.2.4 SMBus Alert Response
    4. 8.4 Register Maps
      1. 8.4.1 ALL Register Map
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Electrical Interface
      2. 9.2.2 Design Requirements
        1. 9.2.2.1 Optical Interface
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Optomechanical Design
      4. 9.2.4 Application Curves
    3. 9.3 Do's and Don'ts
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Soldering and Handling Recommendations
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

All specifications at TA = 25°C, VDD = 3.3 V, 100-ms conversion-time per channel, automatic full-scale range, white LED and normal-angle incidence of light, unless otherwise specified. Spec parameters are preliminary, subject to change.over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Optical
Number of Channels 4
ʎpeak Peak irradiance spectral responsivity CH0 (X) 600 nm
CH1(Y) 550 nm
CH2(Z) 460 nm
CH3(W) 500 nm
ADC resolution 9 20 bits
Range determination 3 bits
Tintg Light Integration-time per channel (4) Conversion-time CT = 0x6 25 ms
Conversion-time CT = 0xB 800 ms
RCH0 Peak Responsivity CH0 (X) Lowest auto gain range, 800 ms conversion time per channel 2770 codes per μW/cm2
RCH1 CH1 (Y) Lowest auto gain range, 800 ms conversion time per channel  3960 codes per μW/cm2
RCH2 CH2 (Z) Lowest auto gain range, 800 ms conversion time per channel  1910 codes per μW/cm2
RCH3 CH3 (W) Lowest auto gain range, 800 ms conversion time per channel  6950 codes per μW/cm2
ERlux Equivalent Resolution Lowest auto gain range, 100 ms conversion-time per channel 17.2 mlux
Lowest auto gain range, 800 ms conversion-time per channel 2.15 mlux
EvFS Full-scale equivalent Illuminance 144284 lux
Ev Measurement output result from lux measurement 2000 lux input(1) 1800 2000 2200 lux
Relative accuracy between gain ranges (2) All channels 0.6 %
EvIR Infrared response(6) 850nm near infra-red, all channels except for CH3 (W) 0.2 %
Light source variation for lux measurement (incandescent, halogen, fluorescent) Bare device, no cover glass 4 %
Linearity Input illuminance > 2254 lux , 100 ms conversion-time per channel, all channels 2 %
Input illuminance <= 2254 lux , 100 ms conversion-time per channel, all channels 5 %
Dark Measurement All channels 0 10 codes
Drift across temperature CH0 (X) 0.02 %/°C
CH1 (Y) 0.02 %/°C
CH2 (Z) 0.05 %/°C
CH3 (W) 0.05 %/°C
Angular response (FWHM) CH0 (X) 134 °
CH1 (Y) 121 °
CH2 (Z) 99 °
CH3 (W) 128 °
PSRR Power-supply rejection ratio(3) VDD at 3.6 V and 1.6 V, 30 different sources, all channels 0.2 %/V
POWER SUPPLY
VDD Power supply 1.6 3.6 V
VI2C Power supply for I2C pull up resistor I2C pullup resistor, VDD ≤ VI2C 1.6 5.5 V
IQACTIVE Active Current Dark 24 µA
Full-scale lux 29 µA
IQ Quiescent current Dark 2 µA
Full-scale lux 2.6 µA
POR Power-on-reset threshold 0.8 V
DIGITAL
CIO I/O Pin Capacitance 3 pF
VIL Low-level input voltage (SDA, SCL, and ADDR) 0 0.3 X VDD V
VIH High-level input voltage (SDA, SCL, and ADDR) 0.7 X VDD 5.5 V
IIL Low-level input current (SDA, SCL, and ADDR) 0.01 0.25(5) µA
VOL Low-level output voltage (SDA and INT) IOL=3mA 0.32 V
IZH Output logic high, high-Z leakage current (SDA, INT) Measured with VDD at pin 0.01 0.25(5) µA
TEMPERATURE
Specified temperature range –40 85 °C
(1) Tested with the white LED calibrated to 2000 lux.
(2) Characterized by measuring fixed near-full-scale light levels on the higher adjacent full-scale range setting.
(3) PSRR is the percent change of the measured lux output from the current value, divided by the change in power supply voltage, as characterized by results from 3.6-V and 1.6-V power supplies.
(4) The conversion-time, from start of conversion until the data are ready to be read, is the integration-time plus analog-to-digital conversion-time.
(5) The specified leakage current is dominated by the production test equipment limitations. Typical values are much smaller.
(6) Tested with a near infrared LED of 850nm wavelength.