SBAS901C July   2018  – October 2020 REF34-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1. 6.1 Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
  8. Typical Characteristics
  9. Parameter Measurement Information
    1. 9.1 Solder Heat Shift
    2. 9.2 Long-Term Stability
    3. 9.3 Thermal Hysteresis
    4. 9.4 Power Dissipation
    5. 9.5 Noise Performance
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Supply Voltage
      2. 10.3.2 Low Temperature Drift
      3. 10.3.3 Load Current
    4. 10.4 Device Functional Modes
      1. 10.4.1 EN Pin
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Basic Voltage Reference Connection
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Input and Output Capacitors
          2. 11.2.1.2.2 4-Wire Kelvin Connections
          3. 11.2.1.2.3 VIN Slew Rate Considerations
          4. 11.2.1.2.4 Shutdown/Enable Feature
        3. 11.2.1.3 Application Curves
      2. 11.2.2 Advanced Driver Assistance Systems (ADAS) Microcontroller Connection
        1. 11.2.2.1 Basic Voltage Reference Connection
        2. 11.2.2.2 Design Requirements
        3. 11.2.2.3 Detailed Design Procedure
        4. 11.2.2.4 Enable Feature in ADAS
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Receiving Notification of Documentation Updates
    3. 14.3 Support Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at TA = 25°C, VIN = VEN = 12 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted)

GUID-1CD69C0E-D3A9-4303-B1C8-FDF2DF9A7138-low.gifFigure 8-1 Temperature Drift
GUID-327B3618-B82B-4324-9911-F3961CB60002-low.gifFigure 8-3 Output Voltage Accuracy vs Temperature
GUID-EA2903BE-4142-436A-8BA7-71052E87405C-low.gifFigure 8-5 Power-Supply Rejection Ratio vs Frequency
GUID-7A1ADF6F-4CA7-48E5-99A8-CDBA1A8678F2-low.gifFigure 8-7 Load Regulation Sourcing
GUID-F7484669-5737-4712-851E-C64015357363-low.gifFigure 8-9 Noise Performance 10 Hz to 10 kHz
GUID-4D2FDB08-6117-4F2D-8757-9DA70D84159B-low.gifFigure 8-11 Load Transient
GUID-2A8E2047-3F12-41F4-A841-D7C4FDA921A6-low.gifFigure 8-13 Load Transient
GUID-5F82D5DD-63F1-4BA4-B682-B2960C3707EB-low.gifFigure 8-15 Line Transient
GUID-98196DCE-CE9C-4726-9CE9-CB4F47A0E85C-low.gifFigure 8-17 Thermal Hysteresis Distribution (Cycle 1) - DBV Package
GUID-20201020-CA0I-BHWG-B2KD-JF2DZF9MTMMH-low.gifFigure 8-19 Thermal Hysteresis Distribution (Cycle 1) - DGK Package
GUID-AE69A098-61D6-4054-B7D8-54B38733D1BF-low.gif
Refer to Section 9.1 for more information
Figure 8-21 Solder Heat Shift Distribution - DBV Package
GUID-04145224-63E9-446E-A2CC-FA2BB5736AEE-low.gifFigure 8-23 Turnon Time (Enable)
GUID-E0EBA014-3DD8-490E-972A-F2C312338495-low.gifFigure 8-25 Long Term Stability - 1000 hours (VREF) - DBV Package
GUID-F2185512-6C4D-4BE4-AB76-6DEA841A467F-low.gifFigure 8-2 VIN vs IQ Over Temperature
GUID-DCDF45AF-AA3A-4D1C-A477-CF7A887489E2-low.gifFigure 8-4 Quiescent Current vs Temperature
GUID-3962F902-29E8-4AEF-B318-54AFA851DC8A-low.gifFigure 8-6 Line Regulation
GUID-588E585C-7591-4668-A4CB-F27FAC888442-low.gifFigure 8-8 Load Regulation Sinking
GUID-497C6590-9805-4A1B-9190-C7A87BA0C2B5-low.gifFigure 8-10 Load Transient
GUID-B7AD0287-C8FC-4372-BB5D-90EB438DED65-low.gifFigure 8-12 Load Transient
GUID-CB251955-EE2E-4713-8E43-776E22E47005-low.gifFigure 8-14 Line Transient
GUID-876C39EF-8392-4EBF-B41F-B36AD55D334F-low.gifFigure 8-16 Quiescent Current Shutdown Mode
GUID-D8635073-378E-4EBC-B691-D72930666755-low.gifFigure 8-18 Thermal Hysteresis Distribution (Cycle 2) - DBV Package
GUID-20201020-CA0I-2QF8-CCJF-XWSVGRNXCRPP-low.gifFigure 8-20 Thermal Hysteresis Distribution (Cycle 2) - DGK Package
GUID-20201020-CA0I-HNT2-0H5X-SXXNJGJ0MDFP-low.gif
Refer to Section 9.1 for more information
Figure 8-22 Solder Heat Shift Distribution - DGK Package
GUID-FBF72FD4-8F91-42DB-8C3F-5937D5C29675-low.gifFigure 8-24 0.1-Hz to 10-Hz Noise (VREF)
GUID-20201022-CA0I-TNRD-09NL-GJ0DJZSK15SZ-low.gifFigure 8-26 Long Term Stability - 1000 hours (VREF) - DGK Package