SBOS410H June   2007  – June 2016 REF5010 , REF5020 , REF5025 , REF5030 , REF5040 , REF5045 , REF5050

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Solder Heat Shift
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Temperature Monitoring
      2. 9.3.2 Temperature Drift
      3. 9.3.3 Thermal Hysteresis
      4. 9.3.4 Noise Performance
      5. 9.3.5 Output Adjustment Using the TRIM/NR Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Basic Connections
      2. 9.4.2 Supply Voltage
      3. 9.4.3 Negative Reference Voltage
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 16-bit, 250-KSPS Data Acquisition System
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Power Dissipation
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Parameter Measurement Information

8.1 Solder Heat Shift

The materials used in the manufacture of the REF50xx have differing coefficients of thermal expansion, resulting in stress on the device die when the part is heated. Mechanical and thermal stress on the device can cause the output voltages to shift, degrading the initial accuracy and drift specifications of the product. Reflow soldering is a common cause of this error.

To illustrate this effect, a total of 36 devices were soldered on printed-circuit-boards using lead-free solder paste and the paste manufacturer suggested reflow profile. The reflow profile is as shown in Figure 28. The printed-circuit-board is comprised of FR4 material. The board thickness is 0.8 mm and the area is 13 mm × 13 mm.

The reference voltage is measured before and after the reflow process across temperature; the typical shift of accuracy and drift is displayed in Figure 29 through Figure 36. Although all tested units exhibit very low shifts, higher shifts are also possible depending on the size, thickness, and material of the printed-circuit-board. An important note is that the histograms display the typical shift for exposure to a single reflow profile. Exposure to multiple reflows, as is common on printed circuit boards (PCBs) with surface-mount components on both sides, causes additional shifts in the output bias voltage. If the PCB is exposed to multiple reflows, then solder the device in the last pass to minimize device exposure to thermal stress.

REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 C044_SBOS600.png Figure 28. Reflow Profile
REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 C011_SBOS410.png Figure 29. Solder Heat Shift Distribution (%),
SOIC Package
REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 C012_SBOS410.png Figure 31. Drift Pre-Soldering Distribution,
SOIC Package
REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 C008_SBOS410.png Figure 33. Drift Distribution Pre-Soldering,
VSSOP Package
REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 C014_SBOS410.png Figure 35. Drift Shift Distribution,
SOIC Package
REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 C010_SBOS410.png Figure 30. Solder Heat Shift Distribution (%),
VSSOP Package
REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 C013_SBOS410.png Figure 32. Drift Post Soldering Distribution,
SOIC Package
REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 C009_SBOS410.png Figure 34. Drift Distribution Post-Soldering,
VSSOP Package
REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 C007_SBOS410.png Figure 36. Drift Shift Distribution,
VSSOP Package