SNVSCN7A November   2023  – December 2023 REF54

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics REF54250
    6. 6.6  Electrical Characteristics REF54300
    7. 6.7  Electrical Characteristics REF54410
    8. 6.8  Electrical Characteristics REF54450
    9. 6.9  Electrical Characteristics REF54500
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Temperature Drift
    2. 7.2 Long-Term Stability
    3. 7.3 Noise Performance
      1. 7.3.1 1/f Noise
      2. 7.3.2 Broadband Noise
    4. 7.4 Thermal Hysteresis
    5. 7.5 Solder Heat Shift
    6. 7.6 Power Dissipation
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 EN Pin
      2. 8.3.2 NR Pin
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Basic Voltage Reference Connection
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Reference Attach With High Precision ADC
    3. 9.3 Power Supply Recommendation
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.6 Power Dissipation

The REF54 voltage references are capable of source and sink up to 10 mA of load current across the rated input voltage range. However, when used in applications subject to high ambient temperatures, the input voltage and load current must be carefully monitored to make sure that the device does not exceed the maximum power dissipation rating. The maximum power dissipation of the device can be calculated with Equation 3:

Equation 3. GUID-C865142A-CD45-4E82-8196-247C9107CB95-low.gif

where

  • PD is the device power dissipation
  • TJ is the device junction temperature
  • TA is the ambient temperature
  • RθJA is the package (junction-to-air) thermal resistance

Because of this relationship, acceptable load current in high temperature conditions can be less than the maximum current-sourcing capability of the device. Do not operate the device outside of the maximum power rating because doing so can result in premature failure or permanent damage to the device.