SLLSEH0F July   2013  – August 2014 SN65HVD01

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Dissipation Ratings
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Equivalent Input and Output Schematic Diagrams
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Bus Loading
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (March 2014) to F Revision

  • Changed Figure 22 image and CH3 scale from: 100 V/div To 2 V/divGo
  • Changed Figure 23 CH3 scale from: 100 V/div To 2 V/divGo

Changes from D Revision (November 2013) to E Revision

  • Changed the data sheet to the new TI standard layout Go
  • Added the Device Information Table Go
  • Added the Handling Ratings tableGo
  • Added the Detailed Description sectionGo
  • Changed Figure 17Go
  • Added the Applications and Implementation sectionGo
  • Deleted the Application Information sectionGo
  • Added the Power Supply RecommendationsGo
  • Added the Layout section Go

Changes from C Revision (November 2013) to D Revision

  • Changed Feature From: Small 3 mm x 3 mm VQFN Package To: Small 3 mm x 3 mm SON PackageGo
  • Changed Feature From: Bus-Pin Protection: To: Bus-Pin Protection More Than: Go
  • Changed Feature From: ≤ 15kV To: ±15 kV HBM ProtectionGo
  • Changed Feature From: ≤ 15kV To: ±16 kV Contact DischargeGo
  • Changed Feature From: ≤ 15kV To: ±16 kV Air DischargeGo
  • Changed DESCRIPTION text From: 3 mm x 3 mm, VQFN package To: 3 mm x 3 mm, SON packageGo
  • Changed the ABSOLUTE MAXIMUM RATINGS for IEC 61000-4-2 ESD (Air-Gap Discharge) From MAX = ±15 To: MAX = ±16Go
  • Changed the ABSOLUTE MAXIMUM RATINGS for IEC 61000-4-2 ESD (Contact Discharge) From MAX = ±15 To: MAX = ±16Go
  • Changed the Thermal Information table package From VQFN (DRC) To; SON (DRC)Go

Changes from B Revision (October 2013) to C Revision

  • Changed from Product Preview to Production DataGo

Changes from A Revision (October 2013) to B Revision

  • Added 8 Typical Characteristics curvesGo

Changes from * Revision (July 2013) to A Revision

  • Changed Feature From: 1.8-V to 3.3-V Supply for Data and Enable Signals To: 1.65-V to 3.6-V Supply for Data and Enable SignalsGo
  • Changed Feature From: 3.3 V Supply for Bus Signals To: 3-V to 3.6-V Supply for Bus SignalsGo
  • Changed Feature From: Selectable Data Rates: 250 kbps or 20 Mbps To: SLR Pin Selectable Data Rates: 250 kbps or 20 MbpsGo
  • Changed the list of APPLICATIONSGo
  • Changed the DESCRIPTIONGo
  • Changed From: 100 Ω resistors To: 120 Ω resistors in the Typical Application circuitGo
  • Changed the ELECTRICAL CHARACTERISTICS table valuesGo
  • Changed the SWITCHING CHARACTERISTICS table valuesGo
  • Changed VCC and 3 V to VL in Figure 9 through Figure 16Go
  • Changed Figure 17Go