SLLS545G November   2002  – October 2015 SN55HVD251 , SN65HVD251

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Supply Current
    6. 6.6  Electrical Characteristics: Driver
    7. 6.7  Electrical Characteristics: Receiver
    8. 6.8  VREF-Pin Characteristics
    9. 6.9  Power Dissipation Characteristics
    10. 6.10 Switching Characteristics: Driver
    11. 6.11 Switching Characteristics: Device
    12. 6.12 Switching Characteristics: Receiver
    13. 6.13 Dissipation Ratings
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Mode Control
      2. 8.3.2 High-Speed Mode
      3. 8.3.3 Slope Control Mode
      4. 8.3.4 Low-Power Mode
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length, and Number of Nodes
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 CAN Termination
        2. 9.2.2.2 Loop Propagation Delay
      3. 9.2.3 Application Curve
    3. 9.3 System Example
      1. 9.3.1 ISO 11898 Compliance of HVD251 5-V CAN Bus Transceiver
        1. 9.3.1.1 Introduction
        2. 9.3.1.2 Differential Signal
        3. 9.3.1.3 Common-Mode Signal
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (June 2015) to G Revision

  • Changed the value of HBM "All pins" From: ±14000 V To: ±6000 V. Changed the value of "CANH, CANL and GND" From: ±6000 V To: ±14000 V in the ESD RatingsGo

Changes from E Revision (March 2010) to F Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed the location of section "6.12 VREF-Pin Characteristics" to section 6.8 Go

Changes from C Revision (September 2005) to D Revision

  • Added device SN55HVD251Go
  • Added the DRJ Package.Go
  • Changed the data sheet title From: CAN TRANSCEIVER To: INDUSTRIAL CAN TRANSCEIVERGo
  • Deleted APPLICATIONS bullets: DeviceNet™ Data Buses, Smart Distributed Systems (SDS™), and ISO 11783 Standard Data Bus InterfaceGo
  • Deleted last paragraph from the DESCRIPTION - "The HVD251 may be used..."Go
  • Added Electrical fast transient/burst to the Abs Max Ratings tableGo
  • Deleted the condition - over recommended operating conditions (unless otherwise noted). From the RECOMMENDED OPERATING CONDITIONS tableGo
  • Added SN55HVD251 to the Operating free-air temperature, TA in the ROC tableGo
  • Added DRJ to the Junction-to-case thermal resistanceGo
  • Added DRJ to the Junction-to-board thermal resistanceGo
  • Added the SUPPLY CURRENT tableGo
  • Deleted ICC - Supply current from the DRIVER ELECTRICAL CHARACTERISTICSGo
  • Added T ≥ -40°C to VO(D) Test Conditions in the DRIVER ELECTRICAL CHARACTERISTICS Go
  • Added RNODE = 330 Ω to Differential output voltage (Dominant) (second line of Test Conditions) in the DRIVER ELECTRICAL tableGo
  • Added a third line of Test Conditions to Differential output voltage (Dominant) in the DRIVER ELECTRICAL tableGo
  • Added T ≤ 85°C to VOD®) Test Conditions in the DRIVER ELECTRICAL CHARACTERISTICS Go
  • Deleted ICC - Supply current from the RECEIVER ELECTRICAL CHARACTERISTICSGo
  • Added Receiver noise rejection row to the RECEIVER ELECTRICAL CHARACTERISTIC tableGo
  • Added TYP values to the Differential output signal rise and fall times in the DRIVER SWITCHING CHARACTERISTIC tableGo
  • Changed table title From: ABSOLUTE MAXIMUM POWER DISSIPATION RATINGS To: PACKAGE DISSIPATION RATINGSGo
  • Added the SON (DRJ) option to the PACKAGE DISSIPATION RATINGS tableGo
  • Changed Figure 1 title From: tLOOP1-LOOP TIME To: RECESSIVE-TO-DOMINANT LOOP DELAYGo
  • Changed Figure 2 title From: tLOOP2-LOOP TIME To: DOMINANT-TO-RECESSIVE LOOP DELAYGo
  • Changed Figure 4 From: DRIVER LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE To: DRIVER OUTPUT VOLTAGE vs OUTPUT CURRENTGo
  • Changed Figure 5 From: DRIVER HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE To: DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs OUTPUT CURRENTGo
  • Changed Figure 8 title From: DIFFERENTIAL OUTPUT FALL TIME To: DIFFERENTIAL OUTPUT TRANSITION TIMEGo
  • Changed Figure 12 - Driver VOD, label RNODE was 330Ω±1%Go
  • Changed Table 1 header From: MEASURED To: DIFFERENTIAL INPUTGo
  • Added Note B to Figure 22Go
  • Added a row ( X Open) to Table 2 - DriverGo

Changes from B Revision (September 2003) to C Revision

  • Changed the front page format.Go
  • Changed Junction temperature, TJ - SOIC Package MAX value From 150°C To: 145°CGo
  • Changed the THERMAL CHARACTERISTICS table valuesGo
  • Changed the ABSOLUTE MAXIMUM POWER DISSIPATION RATINGS table valuesGo

Changes from A Revision (September 2003) to B Revision

  • Changed the front page format.Go
  • Changed DESCRIPTION text From: and tolerance to transients of ±50 V To: and tolerance to transients of ±200 VGo

Changes from * Revision (November 2002) to A Revision

  • Changed multiple items within the document.Go