SLLS575A AUGUST   2003  – July 2015 SN65LVDS049

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Device Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Dissipation Rating
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Driver Offset
      2. 8.3.2 Receiver Open Circuit Fail-Safe
      3. 8.3.3 Receiver Common-Mode Range
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Point-to-Point Communications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Bypass Capacitance
          2. 9.2.1.2.2  Driver Supply Voltage
          3. 9.2.1.2.3  Driver Input Voltage
          4. 9.2.1.2.4  Driver Output Voltage
          5. 9.2.1.2.5  Interconnecting Media
          6. 9.2.1.2.6  PCB Transmission Lines
          7. 9.2.1.2.7  Termination Resistor
          8. 9.2.1.2.8  Receiver Supply Voltage
          9. 9.2.1.2.9  Receiver Input Common-Mode Range
          10. 9.2.1.2.10 Receiver Input Signal
          11. 9.2.1.2.11 Receiver Output Signal
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Multidrop Communications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Interconnecting Media
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip vs. Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Parameter Measurement Information

SN65LVDS049 drvr_vod_lls575.epsFigure 1. Driver VOD and VOS Test Circuit
SN65LVDS049 drvr_prop_lls575.gifFigure 2. Driver Propagation Delay and Rise and Fall Time Test Circuit and Waveforms
SN65LVDS049 drvr_hiz_lls575.gifFigure 3. Driver High-Impedance State Delay Test Circuit and Waveforms
SN65LVDS049 rcvr_prop_lls575.gifFigure 4. Receiver Propagation Delay and Rise and Fall Test Circuit and Waveforms
SN65LVDS049 rcvr_hiz_lls575.gifFigure 5. Receiver High-Impedance State Delay Test Circuit and Waveforms
(VCC = 3.3 V)