SCAS966 February 2024 SN74AC16-Q1
ADVANCE INFORMATION
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | PW (TSSOP) | UNIT | |
---|---|---|---|
14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 148.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 81.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 104.5 | °C/W |
ΨJT | Junction-to-top characterization parameter | 22.2 | °C/W |
ΨJB | Junction-to-board characterization parameter | 103.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |