SCLS529D july   2003  – april 2023 SN74AHCT244-Q1

PRODMIX  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Noise Characteristics
    8. 6.8 Operating Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Mode
  9. Application and Implementation
    1. 9.1 Power Supply Recommendations
    2. 9.2 Layout
      1. 9.2.1 Layout Guidelines
        1. 9.2.1.1 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|20
  • DW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

This octal buffer/driver is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

Table 3-1 Package Information (1)
PART NUMBER PACKAGE(2) BODY SIZE (NOM)
SN74AHCT244-Q1 DW (SOIC, 20) 12.80 mm × 7.50 mm
PW (TSSOP, 20) 6.5 mm × 4.4 mm
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com.
Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
GUID-C08230B0-4DB4-4839-A831-F7BA1B53D67C-low.gifFigure 3-1 Logic Diagram (Positive Logic)