SCLS248O october   1995  – july 2023 SN54AHCT32 , SN74AHCT32

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Noise Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1)SN74AHCT32UNIT
DDBDGVNNSPWRGYBQA
14 PINS
RθJAJunction-to-ambient thermal resistance97.5109.5133.359.792.2147.759.0

88.3

°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.762.155.647.349.877.472.5

90.9

RθJBJunction-to-board thermal resistance51.856.966.339.551.090.935.0

56.8

ψJTJunction-to-top characterization parameter22.622.67.832.415.727.23.9

9.9

ψJBJunction-to-board characterization parameter51.656.356.639.450.690.235.1

56.7

RθJC(bot)Junction-to-case (bottom) thermal resistance15.4

33.4

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).