SCLS243P October   1995  – April 2024 SN54AHCT573 , SN74AHCT573

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings #GUID-7B45293C-3589-425B-8D5E-1C6A9CD70F43/SCLS243908
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements
    7. 5.7  Switching Characteristics, SNx4AHCT573
    8. 5.8  Switching Characteristics, SN54AHCT573
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DB|20
  • N|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74AHCT573UNIT
DWDBDGVNNSPW
20 PINS
RθJAJunction-to-ambient thermal resistance79.497.9117.253.379.2103.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance45.759.632.740.045.737.8
RθJBJunction-to-board thermal resistance46.953.158.734.246.854.3
ψJTJunction-to-top characterization parameter18.721.31.1526.419.32.9
ψJBJunction-to-board characterization parameter46.552.758.034.146.453.8
RθJC(bot)Junction-to-case (bottom) thermal resistancen/an/an/an/an/an/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).