SCES892D November   2018  – January 2024 SN74AXC8T245-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7V
    7. 5.7  Switching Characteristics, VCCA = 0.8V
    8. 5.8  Switching Characteristics, VCCA = 0.9V
    9. 5.9  Switching Characteristics, VCCA = 1.2V
    10. 5.10 Switching Characteristics, VCCA = 1.5V
    11. 5.11 Switching Characteristics, VCCA = 1.8V
    12. 5.12 Switching Characteristics, VCCA = 2.5V
    13. 5.13 Switching Characteristics, VCCA = 3.3V
    14. 5.14 Operating Characteristics: TA = 25°C
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Up-Translation and Down-Translation From 0.65V to 3.6V
      2. 7.3.2 Multiple Direction Control Pins
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
      4. 7.3.4 Wettable Flanks
      5. 7.3.5 I/Os with Integrated Static Pull-Down Resistors
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.4 Wettable Flanks

This device includes wettable flanks for at least one package. See the Features section on the front page of the data sheet for which packages include this feature.

GUID-20210830-SS0I-QHWX-L5WT-QDZVQTLHTMWL-low.svg Figure 7-1 Simplified Cutaway View of Wettable-Flank QFN Package and Standard QFN Package After Soldering

Wettable flanks help improve side wetting after soldering, which makes QFN packages easier to inspect with automatic optical inspection (AOI). As shown in Figure 7-1, a wettable flank can be dimpled or step-cut to provide additional surface area for solder adhesion which assists in reliably creating a side fillet. See the mechanical drawing for additional details.