SCDS136C October   2003  – May 2018 SN74CB3T3245

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Functional Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DBQ|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VIK VCC = 3 V, II = –18 mA –1.2 V
VOH See and Figure 1
IIN Control inputs VCC = 3.6 V, VIN = 3.6 V to 5.5 V or GND ±10 µA
II VCC = 3.6 V, Switch ON, VIN = VCC or GND VI = VCC – 0.7 V to 5.5 V ±20 µA
VI = 0.7 V to VCC – 0.7 V –40
VI = 0 to 0.7 V ±5
IOZ(3) VCC = 3.6 V, VO = 0 to 5.5 V, VI = 0, Switch OFF, VIN = VCC or GND ±10 µA
Ioff VCC = 0, VO = 0 to 5.5 V, VI = 0, 10 µA
ICC VCC = 3.6 V, II/O = 0,
Switch ON or OFF, VIN = VCC or GND		 VI  = VCC or GND 40 µA
VI  = 5.5 V 40
ΔICC(4) Control inputs VCC = 3 V to 3.6 V, One input at VCC – 0.6 V, Other inputs at VCC or GND 300 µA
Cin Control inputs VCC = 3.3 V, VIN = VCC or GND 4 pF
Cio(OFF) VCC = 3.3 V, VI/O = 5.5 V, 3.3 V, or GND, Switch OFF, VIN = VCC or GND 5 pF
Cio(ON) VCC = 3.3 V, Switch ON, VIN = VCC or GND VI/O = 5.5 V or 3.3 V 5 pF
VI/O = GND 13
ron(5) VCC = 2.3 V, TYP at VCC = 2.5 V, VI = 0 IO = 24 mA 5 8.5 Ω
IO = 16 mA 5 8.5
VCC = 3 V, VI = 0 IO = 64 mA 5 7
IO = 32 mA 5 7
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(5) Measured by the voltage drop between A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.