SCDS175A September   2004  – December 2022 SN74CBT3383C

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Undershoot Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Data Flow With Near-Zero Propagation Delay
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

The 2-bit bus is connected directly to 1A1 and 1A2 on the SN74CBT3383C, which essentially combines in the bus controller to form a single input or split bus bits. When BE is low and BX is low, the selected bus uses 1A1 and 1B1 as inputs and outputs. This means that Device 1 is connected to the bus controller and Device 2 is connected to Device 3 when BE is low and BX is low. While keeping BE low and BX high, communication is enabled from the bus controller to Device 2 and from Device 1 to Device 3. This setup is especially useful when two controllers or devices need to share the same data from Device 1 and Device 2 and the bus addresses are limited or hard coded.

The 0.1-μF capacitor on VCC is a decoupling capacitor and should be placed as close to the device as possible.