SCLS758D July   2019  – December 2021 SN74HCS00-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (March 2021) to Revision D (December 2021)

  • Added DYY package to the Device Information tableGo
  • Added DYY package information to the Pin Configuration and Functions sectionGo

Changes from Revision B (September 2019) to Revision C (March 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added BQA package to Device Information tableGo
  • Added BQA package information to Pin Configuration and Functions Go
  •  Added DYY package information to Thermal Information table Go
  • Added BQA package information to Thermal Information tableGo

Changes from Revision A (August 2019) to Revision B (September 2019)

  • Added D package to Device Information tableGo
  • Added D package column to Thermal Information tableGo

Changes from Revision * (July 2019) to Revision A (August 2019)

  • Fixed errors in the Pin Function TableGo
  • Deleted "ICC" and "output" from "Continuous current through VCC or GND" row for clarity Go
  • Removed eroneous fmax row from Switching Characteristics tableGo
  • Tightened specifications in Switching Characteristics table to reflect accurate device performanceGo
  • Tightened specifications in Operating Characteristics table to reflect accurate device performanceGo