SCLS402R April   1998  – March 2023 SN74LV165A

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, VCC = 2.5 V ± 0.2 V
    7. 6.7  Timing Requirements, VCC = 3.3 V ± 0.3 V
    8. 6.8  Timing Requirements, VCC = 5 V ± 0.5 V
    9. 6.9  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    10. 6.10 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics,VCC = 5 V ± 0.5 V
    12. 6.12 Timing Diagrams
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Latching Logic
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Power Considerations
      2. 9.2.2 Input Considerations
      3. 9.2.3 Output Considerations
      4. 9.2.4 Detailed Design Procedure
      5. 9.2.5 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 2 5.5 V
VIH High-level input voltage VCC = 2 V 1.5 V
VCC = 2.3 V to 2.7 V VCC × 0.7
VCC = 3 V to 3.6 V VCC × 0.7
VCC = 4.5 V to 5.5 V VCC × 0.7
VIL Low-level input voltage VCC = 2 V 0.5 V
VCC = 2.3 V to 2.7 V VCC × 0.3
VCC = 3 V to 3.6 V VCC × 0.3
VCC = 4.5 V to 5.5 V VCC × 0.3
VI Input voltage 0 5.5 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 2 V –50 µA
VCC = 2.3 V to 2.7 V –2 mA
VCC = 3 V to 3.6 V –6
VCC = 4.5 V to 5.5 V –12
IOL Low-level output current VCC = 2 V 50 µA
VCC = 2.3 V to 2.7 V 2 mA
VCC = 3 V to 3.6 V 6
VCC = 4.5 V to 5.5 V 12
Δt/Δv Input transition rise or fall rate VCC = 2.3 V to 2.7 V 200 ns/V
VCC = 3 V to 3.6 V 100
VCC = 4.5 V to 5.5 V 20
TA Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating CMOS Inputs