Changes from Revision B (April 2008) to Revision C (February 2024)
- Added Package Information table, Pin Functions table,
ESD Ratings table, Thermal
Information table, Device Functional
Modes,Application and
Implementation section, Device and Documentation Support
section, and Mechanical, Packaging, and
Orderable Information section Go
- Added BQA package to Package Information table, Pin
Configuration and Functions section and Thermal Information table Go