SCES424M January   2003  – August 2022 SN74LVC1G3157

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Analog Switch Characteristics
    7. 6.7 Switching Characteristics 85°C
    8. 6.8 Switching Characteristics 125°C
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision L (May 2017) to Revision M (August 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the Pin Configuration and Functions sectionGo
  • Updated the equation in the Detailed Design Procedure sectionGo

Changes from Revision K (January 2017) to Revision L (May 2017)

  • Deleted Feature "Useful for Both Analog and Digital Applications" Go
  • Deleted Feature "High Degree of Linearity" Go
  • Changed the first sentence of the Description From: "This single-pole double-throw (SPDT)..." To: "This single channel single pole double-throw (SPDT)..." Go
  • Added the X2SON (DTB) package to the Device Information Go
  • Added the X2SON (DTB) Package, to the Pin Configuration and Functions Go
  • Changed II/O To: II/OK for I/O port diode current in the Absolute Maximum Ratings Go
  • Added the DTB (X2SON) package to the Thermal Information tableGo
  • Changed Note 1 and Note 2 n the Analog Switch Characteristics tableGo
  • Deleted Note 3 "Specified by design" from the Analog Switch Characteristics tablesGo
  • Deleted Note 4 "Specified by design" from the Switch Characteristics 85°C tablesGo
  • Deleted Note 4 "Specified by design" from the Switch Characteristics 125°C tablesGo
  • Changed Figure 7-2, From: SW1 = VIL to SW1 = VIH, From: SW2 = VIH to: SW2 = VIL Go
  • Changed Figure 7-5 Go
  • Added a series 50-Ω resistor on B1 in Figure 7-6 Go
  • Changed Figure 7-7 Go

Changes from Revision J (June 2016) to Revision K (January 2017)

  • Added new applications to Applications section Go
  • Added Operating free-air temperature, TA for BGA and all other packages in Recommended Operating Conditions Go
  • Added 125°C data to Electrical Characteristics table. Go
  • Added 85°C to title to differentiate from new 125°C Switching Characteristics section. Go
  • Added 125°C Switching Characteristics section and data. Go

Changes from Revision I (June 2015) to Revision J (June 2016)

  • Deleted 200-V Machine Model (A115-A) from Features Go
  • Changed Feature From: "Operating Frequency Typically 300 MHz at Room Temperature" To: "Operating Frequency Typically 340 MHz at Room Temperature"Go
  • Updated Device Information tableGo
  • Updated pinout images for all PackagesGo
  • Added temperature ranges for Storage temperature, Tstg and Junction temperature, TJ in Absolute Maximum Ratings Go
  • Changed MAX value ±1 to ±0.1 for Ioff and IIN in Electrical Characteristics tableGo
  • Added Receiving Notification of Documentation Updates sectionGo

Changes from Revision H (May 2012) to Revision I (June 2015)

  • Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Updated Features.Go

Changes from Revision G (September 2011) to Revision H (May 2012)

  • Changed YZP with correct pin labels. Go
  • Added Thermal Information tableGo
  • Changed to correct Pin Label "S"Go