SCES203Q April   1999  – September 2021 SN74LVC2G74

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, –40°C to +85°C
    7. 6.7  Timing Requirements, –40°C to +125°C
    8. 6.8  Switching Characteristics, –40°C to +85°C
    9. 6.9  Switching Characteristics, –40°C to +125°C
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Power Button Circuit
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • YZP|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision P (July 2016) to Revision Q (September 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the Application and Information sectionGo
  • Updated the Device Power Button Circuit figure in the Typical Power Button Circuit sectionGo

Changes from Revision O (January 2015) to Revision P (July 2016)

  • Changed SSOP to SM8 in Device Information tableGo
  • Updated pinout images to new formatGo
  • Added pin number for DSBGA package in Pin Functions tableGo
  • Changed 6 PINS to 8 PINS in Thermal Information tableGo
  • Changed 23 to 2.3 for tsu data in Timing Requirements, –40°C to +125°C Go

Changes from Revision N (July 2013) to Revision O (January 2015)

  • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from Revision M (February 2007) to Revision N (July 2013)

  • Changed Ioff description in Features.Go
  • Added parameter values for –40 to +125°C temperature ratings in Electrical Characteristics table.Go
  • Changed Timing Requirements, –40°C to +85°C table.Go
  • Added Timing Requirements, –40°C to +125°C table.Go
  • Changed Switching Characteristics, –40°C to +85°C table.Go
  • Added Switching Characteristics, –40°C to +125°C table.Go