SLLSEA9B February   2012  – August 2015 SN75DP126

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Supply Electrical Characteristics
    6. 7.6  Main Link Input Electrical Characteristics
    7. 7.7  DisplayPort Main Link Output Electrical Characteristics
    8. 7.8  HDMI/DVI Main Link Output Electrical Characteristics
    9. 7.9  HPD/CAD/EN Electrical Characteristics
    10. 7.10 AUX/DDC/I2C Electrical Characteristics
    11. 7.11 DisplayPort Main Link Output Switching Characteristics
    12. 7.12 HDMI/DVI Main Link Switching Characteristics
    13. 7.13 HPD/CAD Switching Characteristics
    14. 7.14 AUX/DDC/I2C Switching Characteristics
    15. 7.15 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Implementing the EN Signal
      2. 8.3.2 Hot Plug Detect (HPD) and Cable Adapter Detect (CAD) Description
      3. 8.3.3 OVS Function Description
      4. 8.3.4 AUX and DDC Configuration Details
      5. 8.3.5 Source-Side Main Link EQ Configuration Details
      6. 8.3.6 DP-HDMI Adaptor ID Buffer
      7. 8.3.7 GPU with a Unified AUX/DDC Configuration
      8. 8.3.8 GPU with Separate DDC and AUX Channels
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes Overview
    5. 8.5 Register Maps
      1. 8.5.1 Link Training and DPCD Description
      2. 8.5.2 Local I2C Interface Overview
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 AC Coupling Capacitors
        2. 9.2.2.2 Configuration Options
        3. 9.2.2.3 Dual Layout for Single or Dual Power Supply
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Analog vs Digital vs High Power
    2. 10.2 Analog Power-Supply Pins and Analog Reference Voltages
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layer Stack
      2. 11.1.2 Power Plane Do's and Don'ts for Four-Layer Boards
      3. 11.1.3 Differential Traces
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Power Supply Recommendations

10.1 Analog vs Digital vs High Power

Digital ground and power carry the RF energy that needs to be contained, so it is best to isolate it from any other power and ground, either analog, high power, or other unrelated trace. If noise from the microcomputer or any other circuit gets on an isolated ground, it can be returned by careful placement of a small RF capacitor in the 470 – 1000 pF range. Choosing the location of the capacitor is by trial and error, and is best done in the screen room.

10.2 Analog Power-Supply Pins and Analog Reference Voltages

The reference voltage of an analog-to-digital (A/D) converter integrated into a microcomputer does supply a very small amount of clocked current; however, it is not enough to be concerned about from a noise-emissions standpoint. Most applications have the analog VSS /VCC tied to the digital VSS1 /VCC1 pins, which does not change significantly the noise characteristics of the A/D nor the radiated emissions