SLASF23 December   2023 TAC5212

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: SPI Interface
    9. 6.9  Switching Characteristics: SPI Interface
    10. 6.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 6.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 6.12 Timing Requirements: PDM Digital Microphone Interface
    13. 6.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 6.14 Timing Diagrams
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
      2. 7.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 7.3.3 Input Channel Configurations
      4. 7.3.4 Output Channel Configurations
      5. 7.3.5 Reference Voltage
      6. 7.3.6 Programmable Microphone Bias
      7. 7.3.7 Signal-Chain Processing
        1. 7.3.7.1 ADC Signal-Chain
          1. 7.3.7.1.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.1.2 Programmable Channel Gain Calibration
          3. 7.3.7.1.3 Programmable Channel Phase Calibration
          4. 7.3.7.1.4 Programmable Digital High-Pass Filter
          5. 7.3.7.1.5 Programmable Digital Biquad Filters
          6. 7.3.7.1.6 Programmable Channel Summer and Digital Mixer
          7. 7.3.7.1.7 Configurable Digital Decimation Filters
            1. 7.3.7.1.7.1 Linear Phase Filters
              1. 7.3.7.1.7.1.1 Sampling Rate: 16 kHz or 14.7 kHz
              2. 7.3.7.1.7.1.2 Sampling Rate: 24 kHz or 22.05 kHz
              3. 7.3.7.1.7.1.3 Sampling Rate: 32 kHz or 29.4 kHz
              4. 7.3.7.1.7.1.4 Sampling Rate: 48 kHz or 44.1 kHz
              5. 7.3.7.1.7.1.5 Sampling Rate: 96 kHz or 88.2 kHz
              6. 7.3.7.1.7.1.6 Sampling Rate: 384 kHz or 352.8 kHz
        2. 7.3.7.2 DAC Signal-Chain
          1. 7.3.7.2.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.2.2 Programmable Channel Gain Calibration
          3. 7.3.7.2.3 Programmable Digital High-Pass Filter
          4. 7.3.7.2.4 Programmable Digital Biquad Filters
          5. 7.3.7.2.5 Programmable Digital Mixer
          6. 7.3.7.2.6 Configurable Digital Interpolation Filters
            1. 7.3.7.2.6.1 Linear Phase Filters
              1. 7.3.7.2.6.1.1 Sampling Rate: 16 kHz or 14.7 kHz
              2. 7.3.7.2.6.1.2 Sampling Rate: 24 kHz or 22.05 kHz
              3. 7.3.7.2.6.1.3 Sampling Rate: 32 kHz or 29.4 kHz
              4. 7.3.7.2.6.1.4 Sampling Rate: 48 kHz or 44.1 kHz
              5. 7.3.7.2.6.1.5 Sampling Rate: 96 kHz or 88.2 kHz
              6. 7.3.7.2.6.1.6 Sampling Rate: 384 kHz or 352.8 kHz
      8. 7.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. 7.5.1 TAC5212 Registers
      2. 7.5.2 TAC5212 Registers
      3. 7.5.3 TAC5212 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Register Maps

This section describes the control registers for the device in detail. All these registers are eight bits in width and allocated to device configuration and programmable coefficients settings. These registers are mapped internally using a page scheme that can be controlled using either I2C or SPI communication to the device. Each page contains 128 bytes of registers. All device configuration registers are stored in page 0, page 1 and page 3. Page 0 is the default page setting at power up (and after a software reset). The device current page can be switch to a new desired page by using the PAGE[7:0] bits located in register 0 of every page.

Do not read from or write to reserved pages or reserved registers. Write only default values for the reserved bits in the valid registers.

The procedure for register access across pages is:

  • Select page N (write data N to register 0 regardless of the current page number)
  • Read or write data from or to valid registers in page N
  • Select the new page M (write data M to register 0 regardless of the current page number)
  • Read or write data from or to valid registers in page M
  • Repeat as needed