SLOS795F September   2013  – October 2017 TAS5414C-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for I2C Interface Signals
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descption
      1. 7.3.1  Preamplifier
      2. 7.3.2  Pulse-Width Modulator (PWM)
      3. 7.3.3  Gate Drive
      4. 7.3.4  Power FETs
      5. 7.3.5  Load Diagnostics
      6. 7.3.6  Protection and Monitoring
      7. 7.3.7  I2C Serial Communication Bus
      8. 7.3.8  I2C Bus Protocol
      9. 7.3.9  Hardware Control Pins
      10. 7.3.10 AM Radio Avoidance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Audio Shutdown and Restart Sequence
      2. 7.4.2 Latched-Fault Shutdown and Restart Sequence Control
    5. 7.5 Programming
      1. 7.5.1 Random Write
      2. 7.5.2 Sequential Write
      3. 7.5.3 Random Read
      4. 7.5.4 Sequential Read
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Hardware and Software Design
        2. 8.2.2.2 Parallel Operation (PBTL)
        3. 8.2.2.3 Input Filter Design
        4. 8.2.2.4 Amplifier Output Filtering
        5. 8.2.2.5 Line Driver Applications
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
    4. 10.4 Electrical Connection of Heat Slug and Heat Sink
    5. 10.5 EMI Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PHD|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.