SCPS198C September   2014  – February 2017 TCA9534A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
      2. 8.3.2 Interrupt Output (INT)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register and Command Byte
      3. 8.6.3 Register Descriptions
        1. 8.6.3.1 Bus Transactions
          1. 8.6.3.1.1 Writes
          2. 8.6.3.1.2 Reads
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Calculating Junction Temperature and Power Dissipation
        2. 9.2.1.2 Minimizing ICC When I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Specifications

Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage –0.5 6 V
VI Input voltage (2) –0.5 6 V
VO Output voltage (2) –0.5 6 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 –20 mA
IIOK Input-output clamp current VO < 0 or VO > VCC ±20 mA
IOL Continuous output low current through a single P-port VO = 0 to VCC 50 mA
IOH Continuous output high current through a single P-port VO = 0 to VCC –50 mA
ICC Continuous current through GND by all P-ports, INT, and SDA 250 mA
Continuous current through VCC by all P-ports –160
TJ(MAX) Maximum junction temperature 100 °C
Tstg Storage temperature –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

Handling Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 1.65 5.5 V
VIH High-level input voltage SCL, SDA VCC = 1.65 V to 5.5 V 0.7 × VCC VCC(1) V
A0, A1, A2, P7–P0 VCC = 1.65 V to 2.7 V 0.7 × VCC 5.5
VIL Low-level input voltage SCL, SDA VCC = 1.65 V to 5.5 V –0.5 0.3 × VCC V
A0, A1, A2, P7–P0 VCC = 1.65 V to 2.7 V –0.5 0.3 × VCC
VCC = 3 V to 5.5 V –0.5 0.2 × VCC
IOH High-level output current Any P-port, P7–P0 –10 mA
IOL Low-level output current(2) P00-P07, P10-P17 Tj ≤ 65°C 25 mA
Tj ≤ 85°C 18
Tj ≤ 100°C 9
INT, SDA Tj ≤ 85°C 6
Tj ≤ 100°C 3
ICC Continuous current through GND All P-ports P7-P0, INT, and SDA 200 mA
Continuous current through VCC All P-ports P7-P0 –80
TA Operating free-air temperature –40 85 °C
The SCL and SDA pins shall not be at a higher potential than the supply voltage VCC in the application, or an increase in leakage current, II, will result.
The values shown apply to specific junction temperatures. See the Calculating Junction Temperature and Power Dissipation section on how to calculate the junction temperature.

Thermal Information

THERMAL METRIC(1) TCA9534A UNIT
PW (TSSOP) DW (SOIC)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 122 92.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.4 53.8 °C/W
RθJB Junction-to-board thermal resistance 67.1 56.9 °C/W
ψJT Junction-to-top characterization parameter 10.8 26.4 °C/W
ψJB Junction-to-board characterization parameter 66.5 56.4 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VIK Input diode clamp voltage II = –18 mA 1.65 V to 5.5 V –1.2 V
VPORR Power-on reset voltage, VCC rising VI = VCC or GND, IO = 0 1.2 1.5 V
VPORF Power-on reset voltage, VCC falling VI = VCC or GND, IO = 0 0.75 1 V
VOH P-port high-level output voltage(2) IOH = –8 mA 1.65 V 1.2 V
2.3 V 1.8
3 V 2.6
4.5 V 4.1
IOH = –10 mA 1.65 V 1
2.3 V 1.7
3 V 2.5
4.5 V 4
IOL SDA(4) VOL = 0.4 V 1.65 V to 5.5 V 3 mA
P port(3) VOL = 0.5 V 1.65 V to 5.5 V 8
VOL = 0.7 V 1.65 V to 5.5 V 10
INT (5) VOL = 0.4 V 1.65 V to 5.5 V 3
II SCL, SDA VI = VCC or GND 1.65 V to 5.5 V ±1 μA
A2–A0 ±1
IIH P port VI  = VCC 1.65 V to 5.5 V 1 μA
IIL P port VI  = GND 1.65 V to 5.5 V –1 μA
ICC Operating mode VI = VCC or GND, IO = 0,
I/O = inputs, fscl = 400 kHz, no load
5.5 V 22 40 μA
3.6 V 11 30
2.7 V 8 19
1.65 5 11
Standby mode VI = GND, IO = 0,
I/O = inputs, fscl = 0 kHz, no load
VI = VCC 5.5 V 1.5 3.9
3.6 V 0.9 2.2
2.7 V 0.6 1.8
1.95 V 0.4 1.5
VI = GND 5.5 V 1.5 8.7
3.6 V 0.9 4
2.7 V 0.6 3
1.95 V 0.4 2.2
Ci SCL VI = VCC or GND 1.65 V to 5.5 V 3 8 pF
Cio SDA VIO = VCC or GND 1.65 V to 5.5 V 3 9.5 pF
P port 3.7 9.5
All typical values are at nominal supply voltage (1.8-, 2.5-, 3.3-, or 5-V VCC) and TA = 25°C.
Each P-port I/O configured as a high output must be externally limited to a maximum of 10 mA, and the total current sourced by all I/Os (P-ports P7-P0) through VCC must be limited to a maximum current of 80 mA.
Each P-port I/O configured as a low output must be externally limited to a maximum of 25 mA, and the total current sunk by all I/Os (P-ports P7-P0, INT, and SDA) through GND must be limited to a maximum current of 200 mA.
The SDA pin must be externally limited to a maximum of 12 mA, and the total current sunk by all I/Os (P-ports P7-P0, INT, and SDA) through GND must be limited to a maximum current of 200 mA.
The INT pin must be externally limited to a maximum of 7 mA, and the total current sunk by all I/Os (P-ports P7-P0, INT, and SDA) through GND must be limited to a maximum current of 200 mA.

I2C Interface Timing Requirements

over operating free-air temperature range (unless otherwise noted) (see Figure 19)
MIN MAX UNIT
STANDARD MODE
fscl I2C clock frequency 0 100 kHz
tsch I2C clock high time 4 µs
tscl I2C clock low time 4.7 µs
tsp I2C spike time 50 ns
tsds I2C serial-data setup time 250 ns
tsdh I2C serial-data hold time 0 ns
ticr I2C input rise time 1000 ns
ticf I2C input fall time 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 300 ns
tbuf I2C bus free time between stop and start 4.7 µs
tsts I2C start or repeated start condition setup 4.7 µs
tsth I2C start or repeated start condition hold 4 µs
tsps I2C stop condition setup 4 µs
tvd(data) Valid data time SCL low to SDA output valid 3.45 ns
tvd(ack) Valid data time of ACK condition ACK signal from SCL low to
SDA (out) low
3.45 µs
Cb I2C bus capacitive load 400 pF
FAST MODE
fscl I2C clock frequency 0 400 kHz
tsch I2C clock high time 0.6 µs
tscl I2C clock low time 1.3 µs
tsp I2C spike time 50 ns
tsds I2C serial-data setup time 100 ns
tsdh I2C serial-data hold time 0 ns
ticr I2C input rise time 20 300 ns
ticf I2C input fall time 20 × (VDD / 5.5 V) 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 20 × (VDD / 5.5 V) 300 ns
tbuf I2C bus free time between stop and start 1.3 µs
tsts I2C start or repeated start condition setup 0.6 µs
tsth I2C start or repeated start condition hold 0.6 µs
tsps I2C stop condition setup 0.6 µs
tvd(data) Valid data time SCL low to SDA output valid 0.9 ns
tvd(ack) Valid data time of ACK condition ACK signal from SCL low to
SDA (out) low
0.9 µs
Cb I2C bus capacitive load 400 pF

Switching Characteristics

over operating free-air temperature range (unless otherwise noted) (see Figure 20 and Figure 21)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
MIN MAX UNIT
STANDARD and FAST MODE
tiv Interrupt valid time P port INT 4 µs
tir Interrupt reset delay time SCL INT 4 µs
tpv Output data valid SCL P7–P0 350 ns
tps Input data setup time P port SCL 100 ns
tph Input data hold time P port SCL 1 μs

Typical Characteristics

TA = 25°C (unless otherwise noted)
TCA9534A D001_TCA9539.gif
Figure 1. Supply Current vs Temperature for Different Supply Voltage (VCC)
TCA9534A D003_TCA9539.gif
Figure 3. Supply Current vs Supply Voltage for Different Temperature (TA)
TCA9534A D005_TCA9539.gif
Figure 5. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 1.8 V
TCA9534A D007_TCA9539.gif
Figure 7. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 3.3 V
TCA9534A D010_TCA9539.gif
Figure 9. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 5.5 V
TCA9534A D012_TCA9539.gif
Figure 11. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 1.65 V
TCA9534A D014_TCA9539.gif
Figure 13. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 2.5 V
TCA9534A D016_TCA9539.gif
Figure 15. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 5 V
TCA9534A D018_TCA9539.gif
Figure 17. VCC – VOH Voltage vs Temperature for Different VCC
TCA9534A D002_TCA9539.gif
Figure 2. Standby Supply Current vs Temperature for Different Supply Voltage (VCC)
TCA9534A D004_TCA9539.gif
Figure 4. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 1.65 V
TCA9534A D006_TCA9539.gif
Figure 6. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 2.5 V
TCA9534A D009_TCA9539.gif
Figure 8. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 5 V
TCA9534A D011_TCA9539.gif
Figure 10. II/O Low Voltage vs Temperature for Different VCC and IOL
TCA9534A D013_TCA9539.gif
Figure 12. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 1.8 V
TCA9534A D015_TCA9539.gif
Figure 14. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 3.3 V
TCA9534A D017_TCA9539.gif
Figure 16. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 5.5 V
TCA9534A D019_TCA9539.gif
Figure 18. Δ ICC vs Temperature for Different VCC (VI = VCC – 0.6 V)