SLLSET0D March   2016  – April 2021 TCAN1051-Q1 , TCAN1051G-Q1 , TCAN1051GV-Q1 , TCAN1051H-Q1 , TCAN1051HG-Q1 , TCAN1051HGV-Q1 , TCAN1051HV-Q1 , TCAN1051V-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings, Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Power Rating
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TXD Dominant Timeout (DTO)
      2. 8.3.2 Thermal Shutdown (TSD)
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Unpowered Device
      5. 8.3.5 Floating Terminals
      6. 8.3.6 CAN Bus Short Circuit Current Limiting
      7. 8.3.7 Digital Inputs and Outputs
        1. 8.3.7.1 5-V VCC Only Devices (Devices without the "V" Suffix):
        2. 8.3.7.2 5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
    4. 8.4 Device Functional Modes
      1. 8.4.1 CAN Bus States
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Driver and Receiver Function Tables
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length and Number of Nodes
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 CAN Termination
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (May 2017) to Revision D (April 2021)

  • Added Feature: EMC performance:.. Go
  • Updated the numbering format for tables, figures and cross-references throughout the documentGo
  • Added Feature "Functional Safety-Capable"Go
  • Deleted "Base" from the D and DRB pin images in the Pin Configurations and Functions Go
  • Deleted "Product Preview" from the DRB pin images in the Pin Configurations and Functions Go
  • Added footnote to the GND pin in the Pin Functions table Go
  • Changed ICC Normal Mode Max value From: 180 To 110 in the Electrical Characteristics tableGo
  • Added SR, Differential output slew rate to the Switching Characteristics table Go

Changes from Revision B (May 2016) to Revision C (May 2017)

  • Added items to the Automotive Applications Feature Go
  • Deleted Feature "Meets the December 17th, 2015 Draft of ISO 11898-2 Physical Layer Update"Go
  • Changed Feature From: "Meets the Released ISO 11898-2:2007 and ISO 11898-2:2003 Physical Layer Standards" To: "Meets the ISO 11898-2:2016 and ISO 11898-5:2007 Physical Layer Standards"Go
  • Changed Feature From: "All devices support 2 Mbps CAN FD.." To: "All Devices Support Classic CAN and 2 Mbps CAN FD.."Go
  • Added Feature "Available in SOIC(8) package and leadless VSON(8) package..."Go
  • Changed Applications From: Heavy Machinery ISO11783 To: Heavy Machinery ISOBUS Applications – ISO 11783Go
  • Changed the Functional Block Diagram, removed the Dominant time-out boxGo
  • Changed "D Package for (HV) and (HGV)" To: "DRB Package for (HV) and (HGV)" Go
  • Added Storage temperature range to the Absolute Maximum Ratings tableGo
  • Changed the ESD Ratings table to show the D(SOIC) and DRB (VSON) values Go
  • Changed Human Body Model (HBM) From: ±10000 To: ±16000 in the ESD Ratings tableGo
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD Ratings tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD Ratings tableGo
  • Added the Power Rating table Go
  • Changed VSYM in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Changed VSYM_DC in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" from the Test Condition of CID in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the RECEIVER ELECTRICAL CHARACTERISTICS table tableGo
  • Changed the Functional Block Diagram, removed the Dominant time-out boxGo
  • Changed Table 8-2, BUS OUTPUT columGo

Changes from Revision A (April 2016) to Revision B (May 2016)

  • Added Feature "Meets the Released ISO 11898-2:2007 and ISO 11898-2:2003 Physical Layer Standards" Go
  • Changed Feature From: Meets the Requirements of ISO11898-2 (2016) To: Meets the December 17th, 2015 Draft of ISO 11898-2 Physical Layer Update Go
  • Changed the Applications listGo
  • Added the VSON (8) pin package to the Device Information tableGo
  • Added the VSON (8) pin package to the Pin Configuration and Functions Go
  • Added V(Diff) to the Section 6.1 table Go
  • Added the DRB package to the Thermal Information table Go

Changes from Revision * (March 2016) to Revision A (April 2016)

  • Changed the device status From: Product Preview To: Production Go
  • Added the VSON (8) pin package to the Pin Configuration and Functions Go