SLLSFT5 December   2022 TCAN3403-Q1 , TCAN3404-Q1

ADVANCE INFORMATION  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Device Comparison
  6. 6Pin Configuration and Functions
  7. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  8. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Tape and Reel Information
    2. 8.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDF|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

Figure 6-1 DDF Package, 8-Pin SOT-23
(Top View)
Figure 6-2 D Package, 8-Pin SOIC
(Top View)
Figure 6-3 DRB Package, 8-Pin VSON
(Top View)
Table 6-1 Pin Functions
PINS TYPE(1) DESCRIPTION
NAME NO.
TXD 1 Digital Input CAN transmit data input; integrated pull-up
GND 2 G Ground connection
VCC 3 Supply 3.3 V supply voltage
RXD 4 Digital Output CAN receive data output, tri-stated when device powered off
SHDN 5 Digital Input Device in ultra-low power shutdown mode if pin is high; integrated pull-down (TCAN3404-Q1 only)
VIO Supply I/O supply voltage (TCAN3403-Q1 only)
CANL 6 Bus I/O Low-level CAN bus input/output line
CANH 7 Bus I/O High-level CAN bus input/output line
STB 8 Digital Input Standby input for mode control; integrated pull-up
Thermal Pad (VSON only) — Connect the thermal pad to any internal PCB ground plane using multiple vias for optimal thermal performance.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground.