SBOS874D August   2017  – February 2021 THS4561

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS+ – VS– = 5 V to 12 V
    6. 7.6 Typical Characteristics: (VS+) – (VS–) = 12 V
    7. 7.7 Typical Characteristics: (VS+) – (VS–) = 5 V
    8. 7.8 Typical Characteristics: (VS+) – (VS–) = 3 V
    9. 7.9 Typical Characteristics: (VS+) – (VS–) = 3-V to 12-V Supply Range
  8. Parameter Measurement Information
    1. 8.1 Example Characterization Circuits
    2. 8.2 Output Interface Circuit for DC-Coupled Differential Testing
    3. 8.3 Output Common-Mode Measurements
    4. 8.4 Differential Amplifier Noise Measurements
    5. 8.5 Balanced Split-Supply Versus Single-Supply Characterization
    6. 8.6 Simulated Characterization Curves
    7. 8.7 Terminology and Application Assumptions
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Mode
      2. 9.4.2 Single-Ended Source to Differential Output Mode
        1. 9.4.2.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversions
        2. 9.4.2.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversions
      3. 9.4.3 Differential Input to a Differential Output Mode
        1. 9.4.3.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Differential Open-Loop Gain and Output Impedance
      2. 10.1.2 Setting Resistor Values Versus Gain
      3. 10.1.3 Noise Analysis
      4. 10.1.4 Factors Influencing Harmonic Distortion
      5. 10.1.5 Input Overdrive Performance
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Board Layout Recommendations
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage Total supply voltage, VS = (VS+ – VS–) 13.5 V
Supply turn-on/off dV/dT(2) ±0.35 V/µs
Input, output, power down and common-mode pin voltage range (VS–) – 0.5 (VS+) + 0.5 V
Differential input voltage ±1 V
Current Continuous input current ±10 mA
Continuous output current(3) ±20 mA
Temperature Junction temperature, TJ 150 °C
Operating free-air temperature, TA –40 125 °C
Storage temperature, Tstg –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These stress-only ratings do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Staying below this specification ensures that the edge-triggered ESD absorption devices across the supply pins remains off.
Long-term continuous output current for electromigration limits.