SLVS638D January   2006  – June 2022

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics — TL2575
    6. 6.6 Electrical Characteristics — TL2575HV
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Feedback Connection
      2. 8.3.2 ON/OFF Input
    4. 8.4 Device Functional Modes
      1. 8.4.1 Standby Mode
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
        1. 9.1.2.1 Input Capacitor (CIN)
        2. 9.1.2.2 Output Capacitor (COUT)
        3. 9.1.2.3 Catch Diode
        4. 9.1.2.4 Inductor
        5. 9.1.2.5 Output Voltage Ripple and Transients
        6. 9.1.2.6 Grounding
        7. 9.1.2.7 Reverse Current Considerations
        8. 9.1.2.8 Buck Regulator Design Procedure
        9. 9.1.2.9 Inductor Selection Guide
      3. 9.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (October 2014) to Revision D (June 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the document.Go
  • Updated applicationsGo

Changes from Revision B (January 2007) to Revision C (October 2014)

  • Updated document to new TI data sheet format.Go
  • Deleted Ordering Information table.Go
  • Added Pin Functions table.Go
  • Added ESD Ratings table.Go
  • Changed Thermal Information table.Go
  • Added Detailed Description sectionGo
  • Added Application and Implementation section.Go
  • Added Power Supply Recommendations and Layout sections.Go