SLVS638D January   2006  – June 2022

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics — TL2575
    6. 6.6 Electrical Characteristics — TL2575HV
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Feedback Connection
      2. 8.3.2 ON/OFF Input
    4. 8.4 Device Functional Modes
      1. 8.4.1 Standby Mode
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
        1. 9.1.2.1 Input Capacitor (CIN)
        2. 9.1.2.2 Output Capacitor (COUT)
        3. 9.1.2.3 Catch Diode
        4. 9.1.2.4 Inductor
        5. 9.1.2.5 Output Voltage Ripple and Transients
        6. 9.1.2.6 Grounding
        7. 9.1.2.7 Reverse Current Considerations
        8. 9.1.2.8 Buck Regulator Design Procedure
        9. 9.1.2.9 Inductor Selection Guide
      3. 9.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.2.6 Grounding

The power and ground connections of the TL2575 and TL2575HV devices must be low impedance to help maintain output stability. For the 5-pin packages, both pin 3 and tab are ground, and either connection can be used as they are both part of the same lead frame. With the 16-pin package, all the ground pins (including signal and power grounds) should be soldered directly to wide PCB copper traces to ensure low-inductance connections and good thermal dissipation.