SBOS784C November   2016  – January 2019 TLV172 , TLV2172 , TLV4172

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: TLV172
    2.     Pin Functions: TLV2172
    3.     Pin Functions: TLV4172
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TLV172
    5. 7.5 Thermal Information: TLV2172
    6. 7.6 Thermal Information: TLV4172
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Characteristics
      2. 8.3.2 Phase-Reversal Protection
      3. 8.3.3 Electrical Overstress
      4. 8.3.4 Capacitive Load and Stability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Common-Mode Voltage Range
      2. 8.4.2 Overload Recovery
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 TINA-TI™ (Free Software Download)
        2. 12.1.2.2 DIP Adapter EVM
        3. 12.1.2.3 Universal Op Amp EVM
        4. 12.1.2.4 TI Precision Designs
        5. 12.1.2.5 WEBENCH Filter Designer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TLVx172 family of electromagnetic interference (EMI)-hardened, 36-V, single-supply, low-noise operational amplifiers (op amps) features a THD+N of 0.0002% at 1 kHz with the ability to operate on supplies ranging from 4.5 V (±2.25 V) to 36 V (±18V). These features, along with low noise and very high PSRR, enable the TLVx172 to amplify microvolt-level signals in applications such as HEV and EV automobiles and power trains, medical instrumentation, and more. The TLVx172 device offers good offset and drift, a high bandwidth of 10 MHz, and a slew rate of 10 V/μs with only 2.3 mA of quiescent current over temperature (maximum).

Unlike most op amps that are specified at only one supply voltage, the TLVx172 device is specified from 4.5 V to 36 V. Input signals beyond the supply rails do not cause phase reversal. TLVx172 device is stable with capacitive loads up to 300 pF. The input can operate 100 mV below the negative rail and within 2 V of the positive rail for normal operation. Note that the device can operate with a full rail-to-rail input 100 mV beyond the positive rail, but with reduced performance within 2 V of the positive rail.

The TLVx172 op amp is specified from –40°C to +125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV172 SOIC (8) 4.90 mm × 3.91 mm
SC70 (5) 2.00 mm × 1.25 mm
SOT-23 (5) 2.90 mm × 1.60 mm
TLV2172 SOIC (8) 4.90 mm × 3.91 mm
VSSOP (8) 3.00 mm × 3.00 mm
TLV4172 SOIC (14) 8.65 mm × 3.91 mm
TSSOP (14) 5.00 mm × 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

TLV172 TLV2172 TLV4172 ai_lownoiseamp_TLV172.gif