SBOS782A November   2016  – May 2018 TLV170 , TLV2170 , TLV4170

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Smallest Packaging for 36-V Operational Amplifiers
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: TLV170
    2.     Pin Functions: TLV2170
    3.     Pin Functions: TLV4170
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: TLV170
    5. 6.5 Thermal Information: TLV2170
    6. 6.6 Thermal Information: TLV4170
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics: Table of Graphs
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Phase-Reversal Protection
      3. 7.3.3 Electrical Overstress
      4. 7.3.4 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Common-Mode Voltage Range
      2. 7.4.2 Overload Recovery
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 DIP Adapter EVM
        3. 11.1.1.3 Universal Op Amp EVM
        4. 11.1.1.4 TI Precision Designs
        5. 11.1.1.5 WEBENCH Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

TLV170: DBV Package
5-Pin SOT-23
Top View
TLV170 TLV2170 TLV4170 DAPPER_Single_SOT23.gif
TLV170: D Package
8-Pin SOIC
Top View
TLV170 TLV2170 TLV4170 DAPPER_Single_DIP.gif

Pin Functions: TLV170

PIN I/O DESCRIPTION
NAME TLV170
SOT-23 D
–IN 4 2 I Negative (inverting) input
+IN 3 3 I Positive (noninverting) input
NC(1) — 1, 5, 8 — No internal connection (can be left floating)
OUT 1 6 O Output
V– 2 4 — Negative (lowest) power supply
V+ 5 7 — Positive (highest) power supply
(1) NC indicates no internal connection.
TLV2170: D and DGK Packages
8-Pin SOIC and VSSOP
Top View
TLV170 TLV2170 TLV4170 DAPPER_Dual_DIP.gif

Pin Functions: TLV2170

PIN I/O DESCRIPTION
NAME TLV2170
SOIC VSSOP
(micro size)
–IN A 2 2 I Inverting input, channel A
–IN B 6 6 I Inverting input, channel B
+IN A 3 3 I Noninverting input, channel A
+IN B 5 5 I Noninverting input, channel B
OUT A 1 1 O Output, channel A
OUT B 7 7 O Output, channel B
V– 4 4 — Negative (lowest) power supply
V+ 8 8 — Positive (highest) power supply
TLV4170: D and PW Packages
14-Pin SOIC and TSSOP
Top View
TLV170 TLV2170 TLV4170 DAPPER_Quad_DIP.gif

Pin Functions: TLV4170

PIN I/O DESCRIPTION
NAME SOIC TSSOP
–IN A 2 2 I Inverting input, channel A
–IN B 6 6 I Inverting input, channel B
–IN C 9 9 I Inverting input, channel C
–IN D 13 13 I Inverting input, channel D
+IN A 3 3 I Noninverting input, channel A
+IN B 5 5 I Noninverting input, channel B
+IN C 10 10 I Noninverting input, channel C
+IN D 12 12 I Noninverting input, channel D
OUT A 1 1 O Output, channel A
OUT B 7 7 O Output, channel B
OUT C 8 8 O Output, channel C
OUT D 14 14 O Output, channel D
V– 11 11 — Negative (lowest) power supply
V+ 4 4 — Positive (highest) power supply