SLVSD63B October   2015  – July 2018 TLV62085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
      2.      Efficiency at VIN = 5 V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Save Mode
      2. 7.3.2 100% Duty Cycle Low Dropout Operation
      3. 7.3.3 Soft Start
      4. 7.3.4 Switch Current Limit and Hiccup Short-Circuit Protection
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable
      2. 7.4.2 Power Good
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH® Tools
        2. 8.2.2.2 Setting The Output Voltage
        3. 8.2.2.3 Output Filter Design
        4. 8.2.2.4 Inductor Selection
        5. 8.2.2.5 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Development Support
      1. 11.1.1 Custom Design with WEBENCH® Tools
      2. 11.1.2 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

TJ = 25 °C, and VIN = 3.6 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
IQ Quiescent current into VIN No load, device not switching 17 µA
ISD Shutdown current into VIN EN = Low 0.7 µA
VUVLO Under voltage lock out threshold VIN falling 2.1 2.2 2.3 V
Under voltage lock out hysteresis VIN rising 200 mV
TJSD Thermal shutdown threshold TJ rising 150 °C
Thermal shutdown hysteresis TJ falling 20 °C
LOGIC INTERFACE EN
VIH High-level input voltage VIN = 2.5 V to 6.0 V 1.0 V
VIL Low-level input voltage VIN = 2.5 V to 6.0 V 0.4 V
IEN,LKG Input leakage current into EN pin EN = High 0.01 µA
RPD Pull-down resistance at EN pin EN = Low 400 kΩ
SOFT START, POWER GOOD
tSS Soft start time Time from EN high to 95% of VOUT nominal 0.8 ms
VPG Power good threshold VOUT rising, referenced to VOUT nominal 95%
VOUT falling, referenced to VOUT nominal 90%
VPG,OL Low-level output voltage Isink = 1 mA 0.4 V
IPG,LKG Input leakage current into PG pin VPG = 5.0 V 0.01 µA
OUTPUT
VFB Feedback regulation voltage PWM mode, 2.5 V ≤ VIN ≤ 6 V
TJ = 0°C to 85 °C		 792 800 808 mV
IFB,LKG Feedback input leakage current VFB = 1 V 0.01 µA
RDIS Output discharge resistor EN = LOW, VOUT = 1.8 V 260 Ω
POWER SWITCH
RDS(on) High-side FET on-resistance ISW = 500 mA 31 mΩ
Low-side FET on-resistance ISW = 500 mA 23 mΩ
ILIM High-side FET switch current limit 3.7 4.6 5.5 A
fSW PWM switching frequency IOUT = 1 A 2.4 MHz