SBOS817I June   2017  – August 2021 TLV6741 , TLV6742

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Single Channel
    5. 7.5 Thermal Information for Dual Channel
    6. 7.6 Electrical Characteristics
    7. 7.7 TLV6741: Typical Characteristics
    8. 7.8 TLV6742: Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 THD+ Noise Performance
      2. 8.3.2 Operating Voltage
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 EMI Rejection
      5. 8.3.5 Electrical Overstress
      6. 8.3.6 Typical Specifications and Distributions
      7. 8.3.7 Shutdown Function
      8. 8.3.8 Packages With an Exposed Thermal Pad
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Single-Supply Electret Microphone Preamplifier With Speech Filter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

TLV6742: Typical Characteristics

at TA = 25°C, VS = ±2.75 V, RL = 10 kΩ connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted.

GUID-3D96B9CB-58A9-4603-9EB0-24497A9E848D-low.gif
VCM = V–
Figure 7-39 Offset Voltage Production Distribution
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VCM = V–
Figure 7-41 Offset Voltage vs Temperature (PMOS Input Pair)
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Over full common-mode voltage range
Figure 7-43 Offset Voltage vs Common-Mode Voltage (Full Range)
GUID-5C90B320-1017-420F-99A9-E4119C6A1D73-low.gifFigure 7-45 Offset Voltage vs Common-Mode Voltage (Transition Region)
GUID-67367809-49DD-475B-8264-FFAAD6F81BCA-low.gifFigure 7-47 IB and IOS vs Common-Mode Voltage
GUID-3DB73E28-0B71-4B4F-A243-1A50F4E3E059-low.gifFigure 7-49 0.1-Hz to 10-Hz Flicker Noise
GUID-7F635745-2F20-47A0-9C0D-46F41A969732-low.gifFigure 7-51 CMRR and PSRR vs Frequency (Referred to Input)
GUID-DBAA7112-2402-4374-937E-A2B702B14E0B-low.gif
VCM = V–
Figure 7-53 PSRR vs Temperature
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CL = 10 pF
Figure 7-55 Closed-Loop Gain vs Frequency
GUID-A74F1411-5274-4B8D-BF57-53037D4CCF19-low.gifFigure 7-57 Open-Loop Gain vs Output Voltage
GUID-FE3D0544-DEA9-48BD-81E2-3843BEDDD31F-low.gifFigure 7-59 No Phase Reversal
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VCM = VS / 2, RL = 1 kΩ
Gain = +1, 100-mV output step
Figure 7-61 Small-Signal Overshoot vs Load Capacitance
GUID-3D94389D-44CA-4C4C-9D1D-CA9FF9C8AC02-low.gif
CL = 20 pF, Gain = 1, VIN = 100-mVpp , RL = 1 kΩ
Figure 7-63 Small-Signal Step Response
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CL = 20 pF, Gain = +1, VIN = 2-V step, RL = 1 kΩ
Figure 7-65 Large Signal Step Response
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CL = 20 pF, Gain = 1, VIN = 2-V step
Figure 7-67 Large Signal Settling Time (Positive)
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VCM = 2.5 V
Gain = +1, BW = 80 kHz, VOUT = 0.5 Vrms
Figure 7-69 THD + N vs Frequency
GUID-EF11FD3B-FBEF-4ABC-B834-A8E49594A900-low.gifFigure 7-71 VOUT vs Sourcing Current
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CL = 10 pF, Gain = +1, VS= 5.5 V
Figure 7-73 Maximum Output Voltage vs Frequency
GUID-01042622-DF85-4C36-8D29-8CD42654A769-low.gifFigure 7-75 Quiescent Current vs Supply Voltage
GUID-6F0BF9F8-25F8-43CE-A3ED-0BBE94C01A15-low.gifFigure 7-77 Open-Loop Output Impedance vs Frequency
GUID-51ACBA38-0D89-4600-AB84-75AB07044537-low.gifFigure 7-79 Electromagnetic Interference Rejection Ratio Referred to Noninverting Input (EMIRR+) vs Frequency
GUID-8FF7A296-A0C1-4E36-8BFC-8B8EFC236BE5-low.gifFigure 7-40 Offset Voltage Drift Distribution
GUID-D32A1498-686F-4328-8A36-8E603C15CB88-low.gif
VCM = V+
Figure 7-42 Offset Voltage vs Temperature (NMOS Input Pair)
GUID-8387A942-EC6A-4C28-ADA7-61EA31F64BAA-low.gifFigure 7-44 Offset Voltage vs Common-Mode Voltage (PMOS Input Pair)
GUID-6A0D80A5-07C5-4E60-88CA-C92F4D7678E0-low.gifFigure 7-46 Offset Voltage vs Power Supply
GUID-7516C8B1-E624-4D2F-8C87-9DE648206E47-low.gifFigure 7-48 IB and IOS vs Temperature
GUID-AE1D81F9-E705-4076-93DC-4032C1E1FE6B-low.gifFigure 7-50 Input Voltage Noise Spectral Density vs Frequency
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VS = 5.5 V, VCM = V– to (V+) – 1.2 V
Figure 7-52 CMRR vs Temperature
GUID-1D766F6F-2047-488C-863A-204BEB3E62F8-low.gif
CL = 10 pF
Figure 7-54 Open-Loop Gain and Phase vs Frequency
GUID-677B5ACB-E3E2-49F5-857C-9628296082C9-low.gifFigure 7-56 Open-Loop Gain vs Temperature
GUID-B38241DA-8A58-4D0B-B773-44F7F4644647-low.gifFigure 7-58 Phase Margin vs Capacitive Load
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VCM = VS / 2, RL = 1 kΩ
Gain = –1, 100-mV output step
Figure 7-60 Small-Signal Overshoot vs Load Capacitance
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VIN=0.6 Vpp, G = –10, VIN × gain > VS
Figure 7-62 Overload Recovery
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CL = 20 pF, Gain = –1, VIN = 100-mVpp, RL = 1 kΩ
Figure 7-64 Small-Signal Step Response
GUID-FC1AFAD3-BA25-4A38-857D-D09AF1885E26-low.gif
CL = 20 pF, Gain = –1, VIN = 2-V step, RL = 1 kΩ
Figure 7-66 Large Signal Step Response
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CL = 20 pF, Gain = –1, VIN = 2-V step
Figure 7-68 Large Signal Settling Time (Negative)
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VCM = 2.5 V
BW = 80 kHz
Figure 7-70 THD + N vs Amplitude
GUID-ACDE7D7A-0CB6-4946-B652-9CA5619DE076-low.gifFigure 7-72 VOUT vs Sinking Current
GUID-238D514E-054D-4398-9348-B0BC0A23DA95-low.gifFigure 7-74 Short-Circuit Current vs Temperature
GUID-4104E8EB-900B-48BF-BFCB-EA1A14D45BAC-low.gifFigure 7-76 Quiescent Current vs Temperature
GUID-C3193C41-4033-42E5-AA41-57AD0413CAB4-low.gif
AVDD = 5.5 V, VICM = VOCM = 2.75 V
Figure 7-78 Channel Separation vs Frequency
GUID-4AFFB029-64CD-4FBC-8048-A3A8D8D4C47F-low.gif
VS = 0 to 5.5 V, VOUT = 0 to 2.75 V
Figure 7-80 Turn-On Time