SBVS349C February   2020  – April 2024 TLV761

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Foldback Current Limit
      3. 6.3.3 Undervoltage Lockout (UVLO)
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Reverse Current
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Examples
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.5 V or 2.5 V (whichever is greater), IOUT = 10 mA, CIN = 1.0 µF, and COUT = 1.0 µF (unless otherwise noted)

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For VIN ≥ 3.0 V
Figure 5-1 VOUT Accuracy vs IOUT
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IOUT = 0 mA
Figure 5-3 IQ vs Temperature
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For VIN ≥ 3.0 V
Figure 5-5 IGND vs IOUT
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VIN = 5 V, VOUT = 3.3 V, ramp rate = 0.5 A/µs
Figure 5-7 IOUT Transient From 1 mA to 1 A
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VIN = 5 V VOUT = 3.3 V, IOUT = 1 A, VIN ramp rate = 0.6 V/µs
Figure 5-9 VIN Transient in Dropout From 4 V to 13 V
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IOUT = 1.0 A
Figure 5-11 VDO vs VIN
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Figure 5-13 UVLO Thresholds vs Temperature
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For VIN ≥ 3.0 V
Figure 5-15 Foldback Current Limit vs Temperature
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VOUT = 1.8 V, VIN = 3.3 V
Figure 5-17 PSRR vs IOUT
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IOUT = 0.1 A, RMS noise BW = 10 Hz to 100 kHz
Figure 5-19 Output Noise (Vn) vs VOUT
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IOUT = 10 mA
Figure 5-2 VOUT Accuracy vs VIN
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IOUT = 0 mA
Figure 5-4 IQ Increase Below Minimum VIN
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VIN = 5 V, VOUT = 3.3 V, ramp rate = 0.4 A/µs
Figure 5-6 IOUT Transient From 0 mA to 100 mA
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VIN = 5 V, VOUT = 3.3 V, ramp rate = 0.8 A/µs
Figure 5-8 IOUT Transient From 250 mA to 850 mA
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VOUT = 3.3 V, IOUT = 33 µA, VIN ramp rate = 1.6 V/µs
Figure 5-10 VIN Transient From 5 V to 16 V
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IOUT = 0.8 A
Figure 5-12 VDO vs VIN
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For VIN ≥ 3.0 V
Figure 5-14 VDO vs IOUT
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Figure 5-16 Foldback Current Limit vs Temperature
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VOUT = 1.8 V, IOUT = 0.55 A
Figure 5-18 PSRR vs VIN
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IOUT = 0.1 A, COUT = 22 µF
Figure 5-20 Inrush Current With 22 µF at COUT