SBVS157C April   2011  – September 2015 TLV803 , TLV853

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD Transient Rejection
      2. 8.3.2 Reset During Power Up and Power Down
      3. 8.3.3 Bidirectional Reset Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > Power-Up Reset Voltage)
      2. 8.4.2 Power On Reset (VDD < Power-Up Reset Voltage)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Monitoring Multiple Supplies
      2. 9.1.2 Output Level Shifting
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Evaluation Modules
        2. 12.1.1.2 Spice Models
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (August 2011) to C Revision

  • Added TLV853 device to data sheet Go
  • Changed device part numbers shown on page header to show single TLV803 device instead of lettered-device versionsGo
  • Added Device Information and ESD Ratings tablesGo
  • Added Detailed Description, Application and Implementation, Power-Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Changed Applications section bullets Go
  • Deleted pinouts from front page and moved to Pin Configurations and Functions sectionGo
  • Deleted Package/Ordering Information table; for package and ordering information, see the package option addendum at the end of the data sheet.Go
  • Changed all "free-air" to "junction" and all "TA" to "TJ" for all temperature ranges throughout data sheetGo
  • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement Go
  • Deleted Soldering temperature from Absolute Maximum Ratings table Go
  • Changed Thermal Information table; updated thermal resistance values for all parameters Go
  • Changed "free-air temperature" to "junction temperature" in Electrical Characteristics condition statement Go
  • Changed temperature noted in Switching Characteristics condition statement Go

Changes from A Revision (June 2011) to B Revision

  • Added new paragraph regarding TLV863 to Description sectionGo
  • Added TLV863 pinout to front pageGo
  • Added TLV863M to Package/Ordering InformationGo
  • Added TLV863 to Thermal InformationGo
  • Added TLV863M to Negative-Going Input Threshold Voltage parameterGo
  • Added TLV863M to Hysteresis parameterGo
  • Added TLV863 to Functional Block DiagramGo