SBOS994E November   2019  – January 2022 TLV9351 , TLV9352 , TLV9354

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
      1.      14
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection Circuitry
      2. 7.3.2 EMI Rejection
      3. 7.3.3 Phase Reversal Protection
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Capacitive Load and Stability
      6. 7.3.6 Common-Mode Voltage Range
      7. 7.3.7 Electrical Overstress
      8. 7.3.8 Overload Recovery
      9. 7.3.9 Typical Specifications and Distributions
    4. 7.4 Device Functional Modes
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High Voltage Precision Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (May 2021) to Revision E (January 2022)

  • Added SOT-23-14 (DYY) package in Device Information Go
  • Added SOT-23-14 (DYY) package and pin functions in Pin Configurations and Functions sectionGo
  • Added SOT-23-14 (DYY) package in Thermal Information for Quad Channel sectionGo
  • Changed input resistor values in Equivalent Internal ESD Circuitry Relative to a Typical Circuit Application in Electrical Overstress section to more closely resemble device Go

Changes from Revision C (December 2020) to Revision D (May 2021)

  • Changed VSSOP (8) package in Device Information from Preview to ActiveGo
  • Removed preview notation on VSSOP-8 (DGK) package in Pin Configurations and Functions sectionGo

Changes from Revision B (August 2020) to Revision C (December 2020)

  • Changed SOIC (14) package in Device Information from Preview to ActiveGo
  • Changed TSSOP (14) package in Device Information from Preview to ActiveGo
  • Changed SOT-23 (5) package in Device Information from Preview to ActiveGo
  • Changed SC70 (5) package in Device Information from Preview to ActiveGo
  • Removed preview notation on SOT-23 (DBV) package in Pin Configurations and Functions sectionGo
  • Removed preview notation on SC70 (DCK) package in Pin Configurations and Functions sectionGo
  • Removed preview notation on SOIC-14 (D) and TSSOP-14 (PW) packages in Pin Configurations and Functions sectionGo
  • Corrected package type column headings in the Pin Functions: TLV9351 tableGo
  • Added updates to the Related Documentation sectionGo

Changes from Revision A (March 2020) to Revision B (August 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the document.Go
  • Added SOT-23 (8) package on Device Information sectionGo
  • Removed preview notation on SOT-23 (DDF) package in Pin Configurations and Functions sectionGo

Changes from Revision * (November 2019) to Revision A (March 2020)

  • Changed SOIC (8) package status on Device Information from Preview to Active Go
  • Changed TSSOP (8) package status on Device Information from Preview to Active Go
  • Removed preview notation on SOIC-8 (D) and TSSOP-8 (PW) packages in Pin Configurations and Functions Go
  • Added Typical Characteristics section in Specifications sectionGo